APA (7th ed.) Citation

Huang, Y., Pentapati, S., Agnesina, A., Brunion, M., & Lim, S. K. (2024). On Legalization of Die Bonding Bumps and Pads for 3-D ICs. IEEE transactions on computer-aided design of integrated circuits and systems, 43(9), 2741-2754. https://doi.org/10.1109/TCAD.2024.3382835

Chicago Style (17th ed.) Citation

Huang, Yen-Hsiang, Sai Pentapati, Anthony Agnesina, Moritz Brunion, and Sung Kyu Lim. "On Legalization of Die Bonding Bumps and Pads for 3-D ICs." IEEE Transactions on Computer-aided Design of Integrated Circuits and Systems 43, no. 9 (2024): 2741-2754. https://doi.org/10.1109/TCAD.2024.3382835.

MLA (9th ed.) Citation

Huang, Yen-Hsiang, et al. "On Legalization of Die Bonding Bumps and Pads for 3-D ICs." IEEE Transactions on Computer-aided Design of Integrated Circuits and Systems, vol. 43, no. 9, 2024, pp. 2741-2754, https://doi.org/10.1109/TCAD.2024.3382835.