HotCluster: A Thermal-Aware Defect Recovery Method for Through-Silicon-Vias Toward Reliable 3-D ICs Systems - Dang, Khanh N.; Ahmed, Akram Ben; Abdallah, Abderazek Ben; Tran, Xuan-Tu (IEEE transactions on computer-aided design of integrated circuits and systems, 2022)
Keywords: 3D-Network on Chips (3D-NoCs); Algorithms; architecture and design; Circuit faults; Clustering; Cooling; Defects; Fault tolerant systems; fault-tolerance; Flow mapping; High temperature; Integrated circuit reliability; Integrated circuits; Interconnections; maximum flow minimal cut; Network reliability; Operating temperature; Recovery; Redundancy; Reliability; Routers; through silicon vias (TSVs); Through-silicon vias