APA (7th ed.) Citation

Dang, K. N., Ahmed, A. B., Abdallah, A. B., & Tran, X. (2022). HotCluster: A Thermal-Aware Defect Recovery Method for Through-Silicon-Vias Toward Reliable 3-D ICs Systems. IEEE transactions on computer-aided design of integrated circuits and systems, 41(4), 799-812. https://doi.org/10.1109/TCAD.2021.3069370

Chicago Style (17th ed.) Citation

Dang, Khanh N., Akram Ben Ahmed, Abderazek Ben Abdallah, and Xuan-Tu Tran. "HotCluster: A Thermal-Aware Defect Recovery Method for Through-Silicon-Vias Toward Reliable 3-D ICs Systems." IEEE Transactions on Computer-aided Design of Integrated Circuits and Systems 41, no. 4 (2022): 799-812. https://doi.org/10.1109/TCAD.2021.3069370.

MLA (9th ed.) Citation

Dang, Khanh N., et al. "HotCluster: A Thermal-Aware Defect Recovery Method for Through-Silicon-Vias Toward Reliable 3-D ICs Systems." IEEE Transactions on Computer-aided Design of Integrated Circuits and Systems, vol. 41, no. 4, 2022, pp. 799-812, https://doi.org/10.1109/TCAD.2021.3069370.