Influence of Additives added to Pd-catalyst Treatment Solutions on Electroless Palladium/Gold Plating on Copper Fine Patterns - KATO, Tomohito; YOSHIDA, Akihiro; GUNJI, Takao; WATANABE, Hideto; MATSUMOTO, Futoshi; TANAKA, Shino (Hyōmen gijutsu, 2021)
Keywords: Additives; Ammonia; Ammonium molybdate; Catalysts; Copper; Copper Fine Pattern; Copper plating; Electroless Palladium Plating; Electroless plating; Ethylenediamine; Ethylenediaminetetraacetic acids; Glycine; Gold; Gold plating; Palladium; Pinhole; Pinholes; Potassium chromates; Reliability analysis; Shear strength; Solder Joint Reliability; Soldered joints; Solders; Substrates; Surface treatment; Void