Interfacial and electrical characteristics of a HfO2/n–InAlAs MOS-capacitor with different dielectric thicknesses

AHfO2/n–In Al As MOS-capacitor has the advantage of reducing the serious gate leakage current when it is adopted in In As/Al Sb HEMT instead of the conventional Schottky-gate. In this paper, three kinds of Hf O2/n–InAlAs MOS-capacitor samples with different Hf O2 thickness values of 6, 8, and 10 nm...

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Published in中国物理B:英文版 no. 12; pp. 460 - 464
Main Author 关赫 吕红亮 郭辉 张义门 张玉明 武利翻
Format Journal Article
LanguageEnglish
Published 01.12.2015
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ISSN1674-1056
2058-3834
DOI10.1088/1674-1056/24/12/126701

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Abstract AHfO2/n–In Al As MOS-capacitor has the advantage of reducing the serious gate leakage current when it is adopted in In As/Al Sb HEMT instead of the conventional Schottky-gate. In this paper, three kinds of Hf O2/n–InAlAs MOS-capacitor samples with different Hf O2 thickness values of 6, 8, and 10 nm are fabricated and used to investigate the interfacial and electrical characteristics. As the thickness is increased, the equivalent dielectric constant ε ox of Hf O2 layer is enhanced and the In AlAsHfO2 interface trap density Ditis reduced, leading to an effective reduction of the leakage current. It is found that the Hf O2 thickness of 10 nm is a suitable value to satisfy the demands of most applications of a HfO2/n–InAlAs MOS-capacitor, with a sufficiently low leakage current compromised with the threshold voltage.
AbstractList AHfO2/n–In Al As MOS-capacitor has the advantage of reducing the serious gate leakage current when it is adopted in In As/Al Sb HEMT instead of the conventional Schottky-gate. In this paper, three kinds of Hf O2/n–InAlAs MOS-capacitor samples with different Hf O2 thickness values of 6, 8, and 10 nm are fabricated and used to investigate the interfacial and electrical characteristics. As the thickness is increased, the equivalent dielectric constant ε ox of Hf O2 layer is enhanced and the In AlAsHfO2 interface trap density Ditis reduced, leading to an effective reduction of the leakage current. It is found that the Hf O2 thickness of 10 nm is a suitable value to satisfy the demands of most applications of a HfO2/n–InAlAs MOS-capacitor, with a sufficiently low leakage current compromised with the threshold voltage.
Author 关赫 吕红亮 郭辉 张义门 张玉明 武利翻
AuthorAffiliation Key Laboratory of Wide Band-Gap Semiconductor Materials and Devices of China, School of Microelectronics, Xidian University, Xi' an 710071, China
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Notes AHfO2/n–In Al As MOS-capacitor has the advantage of reducing the serious gate leakage current when it is adopted in In As/Al Sb HEMT instead of the conventional Schottky-gate. In this paper, three kinds of Hf O2/n–InAlAs MOS-capacitor samples with different Hf O2 thickness values of 6, 8, and 10 nm are fabricated and used to investigate the interfacial and electrical characteristics. As the thickness is increased, the equivalent dielectric constant ε ox of Hf O2 layer is enhanced and the In AlAsHfO2 interface trap density Ditis reduced, leading to an effective reduction of the leakage current. It is found that the Hf O2 thickness of 10 nm is a suitable value to satisfy the demands of most applications of a HfO2/n–InAlAs MOS-capacitor, with a sufficiently low leakage current compromised with the threshold voltage.
HfO2/n–InAlAs MOS-capacitor,high-k gate dielectric,interface trap density,leakage current
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PublicationTitle 中国物理B:英文版
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Snippet AHfO2/n–In Al As MOS-capacitor has the advantage of reducing the serious gate leakage current when it is adopted in In As/Al Sb HEMT instead of the...
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StartPage 460
SubjectTerms HEMT器件
InAlAs
MOS电容器
介电层
使用界面
氧化铪
电气特性
等效介电常数
Title Interfacial and electrical characteristics of a HfO2/n–InAlAs MOS-capacitor with different dielectric thicknesses
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