Deep Learning and ECM Fusion for Realization of Advanced Resistive Ink FSS-Based Customized Microwave Absorber

This letter introduces a simple frequency-selective surface (FSS) design for a resistive microwave absorber in X-band applications. It utilizes a polymer-based dielectric substrate and Y-Shield HSF 64 resistive ink with a conductivity of 640 S/m. The absorber's design is realized using a deep n...

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Published inIEEE journal on electromagnetic compatibility practice and applications Vol. 6; no. 4; pp. 132 - 137
Main Authors Agrawal, Anjali, Kumar, Anil, Panwar, Ravi
Format Journal Article
LanguageEnglish
Published New York IEEE 01.12.2024
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
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ISSN2637-6423
2637-6423
DOI10.1109/LEMCPA.2024.3458790

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Abstract This letter introduces a simple frequency-selective surface (FSS) design for a resistive microwave absorber in X-band applications. It utilizes a polymer-based dielectric substrate and Y-Shield HSF 64 resistive ink with a conductivity of 640 S/m. The absorber's design is realized using a deep neural network (DNN) integrated with equivalent circuit modeling (ECM) and validated through the bees algorithm (BeA). Fabrication involves manually creating <inline-formula> <tex-math notation="LaTeX">1\times 3 </tex-math></inline-formula> unit cells, followed by experimental evaluation using the WR-90 rectangular waveguide method. Results from ECM-backed DNN, ECM-assisted BeA, and full-wave simulation align closely with measured data, demonstrating a minimum reflection coefficient of −22.5 dB at the resonant frequency of 10 GHz with a bandwidth of 4.2 GHz (8.2-12.4 GHz) for normal incidence. This letter also examines the surface current distribution and electromagnetic (EM) properties, highlighting the absorber's simplicity, flexibility, lightweight construction, polarization insensitivity, angular stability, and wideband characteristics, making it suitable for customized stealth and electromagnetic- compatibility (EMC) applications.
AbstractList This letter introduces a simple frequency-selective surface (FSS) design for a resistive microwave absorber in X-band applications. It utilizes a polymer-based dielectric substrate and Y-Shield HSF 64 resistive ink with a conductivity of 640 S/m. The absorber's design is realized using a deep neural network (DNN) integrated with equivalent circuit modeling (ECM) and validated through the bees algorithm (BeA). Fabrication involves manually creating <inline-formula> <tex-math notation="LaTeX">1\times 3 </tex-math></inline-formula> unit cells, followed by experimental evaluation using the WR-90 rectangular waveguide method. Results from ECM-backed DNN, ECM-assisted BeA, and full-wave simulation align closely with measured data, demonstrating a minimum reflection coefficient of −22.5 dB at the resonant frequency of 10 GHz with a bandwidth of 4.2 GHz (8.2-12.4 GHz) for normal incidence. This letter also examines the surface current distribution and electromagnetic (EM) properties, highlighting the absorber's simplicity, flexibility, lightweight construction, polarization insensitivity, angular stability, and wideband characteristics, making it suitable for customized stealth and electromagnetic- compatibility (EMC) applications.
This letter introduces a simple frequency-selective surface (FSS) design for a resistive microwave absorber in X-band applications. It utilizes a polymer-based dielectric substrate and Y-Shield HSF 64 resistive ink with a conductivity of 640 S/m. The absorber’s design is realized using a deep neural network (DNN) integrated with equivalent circuit modeling (ECM) and validated through the bees algorithm (BeA). Fabrication involves manually creating [Formula Omitted] unit cells, followed by experimental evaluation using the WR-90 rectangular waveguide method. Results from ECM-backed DNN, ECM-assisted BeA, and full-wave simulation align closely with measured data, demonstrating a minimum reflection coefficient of −22.5 dB at the resonant frequency of 10 GHz with a bandwidth of 4.2 GHz (8.2–12.4 GHz) for normal incidence. This letter also examines the surface current distribution and electromagnetic (EM) properties, highlighting the absorber’s simplicity, flexibility, lightweight construction, polarization insensitivity, angular stability, and wideband characteristics, making it suitable for customized stealth and electromagnetic- compatibility (EMC) applications.
Author Agrawal, Anjali
Kumar, Anil
Panwar, Ravi
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Cites_doi 10.1109/TAP.2023.3308581
10.1109/LEMCPA.2024.3359149
10.1109/TEMC.2016.2524553
10.1016/j.aeue.2020.153198
10.1109/TEMC.2023.3287581
10.1109/MEMC.2019.8681370
10.1109/TEMC.2022.3213941
10.1002/0471723770
10.1088/1402-4896/ac8ad6
10.1016/j.physe.2022.115527
10.1109/MEMC.0.7543954
10.1109/TEMC.2022.3180745
10.1109/LAWP.2021.3101225
10.1109/TAP.2020.2983756
10.1109/8.475112
10.1016/j.ast.2017.03.006
10.1109/TEMC.2021.3058583
10.1109/TAP.2019.2902660
10.1109/TEMC.2023.3239747
10.1109/LEMCPA.2022.3210020
10.1109/LAWP.2020.2972919
10.1088/1361-6501/aaa8aa
10.1109/8.8632
10.1063/5.0002931
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References ref13
ref12
ref15
ref14
ref11
Pham (ref19) 2005
ref10
ref2
ref1
ref17
ref16
ref18
ref24
ref23
ref25
ref20
ref22
ref21
ref8
ref7
ref9
ref4
ref3
ref6
ref5
References_xml – ident: ref9
  doi: 10.1109/TAP.2023.3308581
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  doi: 10.1109/LEMCPA.2024.3359149
– ident: ref23
  doi: 10.1109/TEMC.2016.2524553
– ident: ref6
  doi: 10.1016/j.aeue.2020.153198
– ident: ref16
  doi: 10.1109/TEMC.2023.3287581
– ident: ref10
  doi: 10.1109/MEMC.2019.8681370
– ident: ref25
  doi: 10.1109/TEMC.2022.3213941
– ident: ref2
  doi: 10.1002/0471723770
– ident: ref7
  doi: 10.1088/1402-4896/ac8ad6
– ident: ref8
  doi: 10.1016/j.physe.2022.115527
– ident: ref11
  doi: 10.1109/MEMC.0.7543954
– ident: ref24
  doi: 10.1109/TEMC.2022.3180745
– ident: ref18
  doi: 10.1109/LAWP.2021.3101225
– ident: ref15
  doi: 10.1109/TAP.2020.2983756
– ident: ref4
  doi: 10.1109/8.475112
– ident: ref1
  doi: 10.1016/j.ast.2017.03.006
– ident: ref14
  doi: 10.1109/TEMC.2021.3058583
– ident: ref13
  doi: 10.1109/TAP.2019.2902660
– ident: ref17
  doi: 10.1109/TEMC.2023.3239747
– volume-title: The bees algorithm
  year: 2005
  ident: ref19
– ident: ref22
  doi: 10.1109/LEMCPA.2022.3210020
– ident: ref12
  doi: 10.1109/LAWP.2020.2972919
– ident: ref20
  doi: 10.1088/1361-6501/aaa8aa
– ident: ref3
  doi: 10.1109/8.8632
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  doi: 10.1063/5.0002931
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Snippet This letter introduces a simple frequency-selective surface (FSS) design for a resistive microwave absorber in X-band applications. It utilizes a polymer-based...
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SubjectTerms Absorption
Artificial neural networks
Current distribution
Customization
Deep learning
Deep neural network (DNN)
Dielectric substrates
Electromagnetic compatibility
electromagnetic compatibility (EMC)
equivalent circuit modeling
Equivalent circuits
Frequency selective surfaces
frequency-selective surface (FSS)
Machine learning
microwave absorber
Microwave absorbers
Microwave circuits
Rectangular waveguides
Reflectance
Reflection coefficient
Resonant frequencies
Search algorithms
stealth technology
Superhigh frequencies
Wave reflection
Title Deep Learning and ECM Fusion for Realization of Advanced Resistive Ink FSS-Based Customized Microwave Absorber
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