Design Challenges for High-Speed Digital Links for Automotive Applications
This paper outlines the state of the art and future directions for high-speed links in modern automotive applications. The technological constraints of signal integrity (SI) are discussed in the context of challenges of the mechanical and atmospheric environment. The requirements are illustrated by...
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| Published in | IEEE electromagnetic compatibility magazine Vol. 13; no. 4; pp. 88 - 95 |
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| Main Authors | , , , , , |
| Format | Journal Article Magazine Article |
| Language | English |
| Published |
New York
IEEE
2024
The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subjects | |
| Online Access | Get full text |
| ISSN | 2162-2264 2162-2272 |
| DOI | 10.1109/MEMC.2024.10942574 |
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| Abstract | This paper outlines the state of the art and future directions for high-speed links in modern automotive applications. The technological constraints of signal integrity (SI) are discussed in the context of challenges of the mechanical and atmospheric environment. The requirements are illustrated by example of automotive Ethernet and its use to establish communication between electronic control units (ECUs). The overview covers design elements and parts inside the ECU enclosure as well as the link segment in between control units. Moreover, the compound system is subject to operational testing and verification of compliance with applicable standards. |
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| AbstractList | This paper outlines the state of the art and future directions for high-speed links in modern automotive applications. The technological constraints of signal integrity (SI) are discussed in the context of challenges of the mechanical and atmospheric environment. The requirements are illustrated by example of automotive Ethernet and its use to establish communication between electronic control units (ECUs). The overview covers design elements and parts inside the ECU enclosure as well as the link segment in between control units. Moreover, the compound system is subject to operational testing and verification of compliance with applicable standards. |
| Author | Alavi, Golzar Klein, Christian El Ouardi, Abdessamad Schuster, Christian Reuschel, Torsten Hernandez-Bonilla, Jose Enrique |
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| References | Matheus (ref28) 2021 LeCroy (ref7) 2024 ref11 Kochi (ref13) 2022 ref17 ref16 ref19 ref18 Hiller (ref6) 2024 Gregor (ref14) 1996; 74 Brist (ref15) 2005 Correa (ref10) 2014 ref24 ref26 Shwartzberg (ref2) 2024 ref20 Armbrecht (ref12) 2017 ref22 Reuschel (ref30) 2019 ref27 ref29 ref8 Alliance (ref23) 2020 ref4 (ref21) 2024 (ref1) 2023 ref5 De Oliveira (ref3) 2021 Alliance (ref25) (ref9) 2022 |
| References_xml | – ident: ref11 doi: 10.1109/EPEP.2007.4387186 – volume-title: Automotive Ethernet: The Definitive Guide, Troy, MI, USA:Intrepid Control Systems year: 2014 ident: ref10 article-title: Automotive Ethernet related standards organizations and associations – volume-title: Automotive Electronics Council year: 2023 ident: ref1 article-title: Failure Mechanism Based Stress Test Qualification for Integrated Circuits in Automotive Applications (Rev-J) – year: 2022 ident: ref13 article-title: Development of greater than 10 Gb/s 26 AWG shielded twisted pair cable publication-title: Automot. Ethernet Congr., Munich, Germany – ident: ref16 doi: 10.1109/EPEPS.2017.8329720 – start-page: 7013 year: 2022 ident: ref9 article-title: IEEE Standard for Ethernet publication-title: IEEE Std 802.3–2022 (Revision of IEEE Std 802.3-2018) – volume-title: IEEE 1000BASE-T1 EMC Test Specification for Transceivers year: 2020 ident: ref23 – volume-title: The evolution of in-vehicle network architectures year: 2024 ident: ref7 – volume: 74 start-page: 124 issue: 4 year: 1996 ident: ref14 article-title: Effects of copper foil type and surface preparation on fine line image transfer in primary imaging of printed wiring boards publication-title: Trans. IMF doi: 10.1080/00202967.1996.11871111 – volume-title: Next PCB year: 2024 ident: ref21 article-title: 4 Main differences between HDI PCB and ordinary PCB – ident: ref5 doi: 10.3934/mbe.2023761 – ident: ref18 doi: 10.1109/ISSE.2013.6648227 – ident: ref4 doi: 10.1109/iscas45731.2020.9180481 – year: 2005 ident: ref15 article-title: Non-classical conductor losses due to copper foil roughness and treatment publication-title: IPC Printed Circuits Expo, Anaheim, CA, USA – volume-title: OPEN Alliance Automotive Ethernet ECU Test Specifications ident: ref25 – ident: ref8 doi: 10.1007/978-3-658-02419-2_1 – ident: ref19 doi: 10.1109/TCPMT.2019.2926355 – year: 2021 ident: ref3 article-title: Service-oriented architecture: chances and challenges publication-title: Automot. Ethernet Congr.. 2021 – volume-title: Dissecting the truth about automotive PHYs year: 2024 ident: ref2 – ident: ref24 doi: 10.1109/TMTT.1976.1128934 – ident: ref17 doi: 10.1109/SPI57109.2023.10145521 – ident: ref29 doi: 10.1109/ISETC50328.2020.9301147 – ident: ref26 doi: 10.1109/EEBDA56825.2023.10090613 – start-page: 227 year: 2021 ident: ref28 article-title: Automotive Ethernet and power supply publication-title: Automotive Ethernet, Cambridge, UK: Cambrige University Press doi: 10.1017/9781108895248.009 – year: 2024 ident: ref6 article-title: Towards central compute and high-speed networking - the first leg of a long journey publication-title: Automot. Ethernet Congr., Munich, Germany – year: 2019 ident: ref30 article-title: Impact of geometry and common-mode choke variability on 100BASE-T1 medium dependent interface publication-title: Dassault 3D Experience Conf., Darmstadt, Germany – ident: ref20 doi: 10.1109/TEMC.2022.3170532 – ident: ref27 doi: 10.1109/EPEPS47316.2019.193205 – year: 2017 ident: ref12 article-title: Future-proof RF connector systems for high speed data communication in vehicles publication-title: GMM Fachtagung - Elektromagnetische Ver-traeglichkeit in der Kfz-Technik, Wolfsburg, Germany – ident: ref22 doi: 10.1109/MEMC.2014.6798802 |
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| SubjectTerms | automotive Control equipment ECU Electronic control Ethernet High speed interconnects PCB Signal integrity |
| Title | Design Challenges for High-Speed Digital Links for Automotive Applications |
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