Application of ORNL Modified Strain Hardening to Primary Creep for thermal fatigue evaluation of Al Wire Bonding Al in Power Module. Keisan Rikigaku Koenkai koen ronbunshu/Keisan Rikigaku Kouenkai kouen rombunshuu. https://doi.org/10.1299/jsmecmd.2023.36.os-1001
Chicago Style (17th ed.) Citation"Application of ORNL Modified Strain Hardening to Primary Creep for Thermal Fatigue Evaluation of Al Wire Bonding Al in Power Module." Keisan Rikigaku Koenkai Koen Ronbunshu/Keisan Rikigaku Kouenkai Kouen Rombunshuu . https://doi.org/10.1299/jsmecmd.2023.36.os-1001.
MLA (9th ed.) Citation"Application of ORNL Modified Strain Hardening to Primary Creep for Thermal Fatigue Evaluation of Al Wire Bonding Al in Power Module." Keisan Rikigaku Koenkai Koen Ronbunshu/Keisan Rikigaku Kouenkai Kouen Rombunshuu, , https://doi.org/10.1299/jsmecmd.2023.36.os-1001.