Panel-Scale Reconfigurable Photonic Interconnects for Scalable AI Computation - Hsueh, Tzu-Chien; Lin, Bill; Chen, Zijun; Fainman, Yeshaiahu (IEEE open journal of solid-state circuits, 2025)
Keywords: Accelerator; Artificial intelligence; bandwidth density; chiplet-to-chiplet communication; edge coupler; energy efficiency; frequency comb; Glass; heterogeneous integration; high-bandwidth memory; High-speed optical techniques; Integrated circuit interconnections; Integrated optics; interconnect; interposer; large language model; micro bump; micro-ring resonator; optical communication; Optical device fabrication; Optical interconnections; Optical switches; packaging; Photonics; power delivery; power density; processor; racetrack resonator; silicon photonics; Substrates; through-silicon via; through-substrate via; wavelength division multiplexing