Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519)

• Published in: Proceedings of the IEEE 2002 International Interconnect Technology Conference : June 3-5, 2002, Hyatt Regency Hotel, Burlingame, CA
• Format: Conference Proceeding
• Language: English
• Published: IEEE 2002
• Subjects: Integrated circuit interconnections
• ISBN: 0780372166; 9780780372160
• DOI: 10.1109/IITC.2002.1014867

The conference program begins with an address on the subject of Ambient Intelligence. This concept refers to the presence of a digital environment that is sensitive, adaptive and responsive to the presence of people. Subsequent presentation sessions address critical issues for ULSI circuits, low k dielectrics, advanced barrier materials and processes, interconnect system performance and reliability, copper/low k integration, and chemical mechanical planarization. Added features this year are new sessions on advanced packaging and optical interconnect that will introduce alternative solutions to the scaling problems facing conventional wiring technology.