Advances in Embedded and Fan-Out Wafer Level Packaging Technologies - Beth Keser, Steffen Kröhnert; Steffen Kroehnert (Wiley, 2019)
Keywords: Chip scale packaging; Components, Circuits, Devices and Systems; Computing and Processing; Integrated circuits; Integrated circuits-Wafer-scale integration; microelectronic packaging research; fan-out wafer level packaging; microelectronic packaging; guide to microelectronic packaging; guide to FO-WLP; packaging technology; Advances in Embedded and Fan-Out Wafer Level Packaging Technologies; embedded technologies; embedded and fan-out wafer level packaging technologies package structure; guide to embedded technology; microelectronic packaging technology; eWLB packaging technology; the electronic packaging industry; FO-WLP technologies; embedded and fan-out wafer level packaging technologies process flows; trends in the electronic packaging industry; device packaging; FO-WLP trends; embedded packaging; FO-WLP; electronic packaging material challenges; electronic packaging; FO-WLP technology applications; embedded wafer-level ball grid array packaging technology; embedded and fan-out wafer level packaging technologies advances