APA (7th ed.) Citation

Beth Keser, S. K., & Kroehnert, S. (2019). Advances in Embedded and Fan-Out Wafer Level Packaging Technologies (1.). Wiley. https://doi.org/10.1002/9781119313991

Chicago Style (17th ed.) Citation

Beth Keser, Steffen Kröhnert, and Steffen Kroehnert. Advances in Embedded and Fan-Out Wafer Level Packaging Technologies. 1. Newark: Wiley, 2019. https://doi.org/10.1002/9781119313991.

MLA (9th ed.) Citation

Beth Keser, Steffen Kröhnert, and Steffen Kroehnert. Advances in Embedded and Fan-Out Wafer Level Packaging Technologies. 1. Wiley, 2019. https://doi.org/10.1002/9781119313991.