Exploring serial vertical interconnects for 3D ICs - Pasricha, Sudeep (2009 46th ACM/IEEE Design Automation Conference, 2009)
Keywords: 3D ICs; Delay; Hardware -- Emerging technologies; Hardware -- Very large scale integration design; Integrated circuit interconnections; Network-on-a-chip; Networks on Chip; Power system interconnection; Repeaters; Serial Interconnect; Silicon; Stacking; Three-dimensional integrated circuits; Through-silicon vias; VLSI; Wire; networks on chip; serial interconnect; VLSI; 3D ICs