Provably good and practically efficient algorithms for CMP dummy fill
To reduce chip-scale topography variation in Chemical Mechanical Polishing (CMP) process, dummy fill is widely used to improve the layout density uniformity. Previous researches formulated the dummy fill problem as a standard Linear Program (LP). However, solving the huge linear program formed by re...
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          | Published in | Proceedings of the 46th Annual Design Automation Conference pp. 539 - 544 | 
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| Main Authors | , , , , | 
| Format | Conference Proceeding | 
| Language | English | 
| Published | 
        New York, NY, USA
          ACM
    
        26.07.2009
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| Series | ACM Conferences | 
| Subjects | |
| Online Access | Get full text | 
| ISBN | 9781605584973 1605584975  | 
| DOI | 10.1145/1629911.1630052 | 
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| Summary: | To reduce chip-scale topography variation in Chemical Mechanical Polishing (CMP) process, dummy fill is widely used to improve the layout density uniformity. Previous researches formulated the dummy fill problem as a standard Linear Program (LP). However, solving the huge linear program formed by real-life designs is very expensive and has become the hurdle in deploying the technology. Even though there exist efficient heuristics, their performance cannot be guaranteed. In this paper, we develop a dummy fill algorithm that is both efficient and with provably good performance. It is based on a fully polynomial time approximation scheme by Fleischer [4] for covering LP problems. Furthermore, based on the approximation algorithm, we also propose a new greedy iterative algorithm to achieve high quality solutions more efficiently than previous Monte-Carlo based heuristic methods. Experimental results demonstrate the effectiveness and efficiency of our algorithms. | 
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| ISBN: | 9781605584973 1605584975  | 
| DOI: | 10.1145/1629911.1630052 |