Advanced Interconnect and Packaging (MDPI - Multidisciplinary Digital Publishing Institute, 2023)
Keywords: 3D IC; aging; antenna current; Au wire bonding; Au–Au bonding; average heat-spreading width; average power handling capability (APHC); Bi aggregation; blood oxygen; broadband; broadside structure; carbon nanotube; circuit model; coverage thickness; Cu-CNT composite; Cu–Sn bonding; deadbeat controller; dual active bridge; electromagnetic bandgap (EBG); electromigration; far-end crosstalk; flow time; focused ion beam (FIB); frequency selective rasorber (FSR); frequency selective surface (FSS); frequency-selective surface analytical approximation; graphene; high-temperature annealing; high-temperature pressure sensor; high-temperature resistant packaging; hot-melt glass; impedance; integrated circuit interconnects; integrated passive device; interposer channel; interposers; kinetic inductance; load feedforward; low-loss substrates; low-temperature soldering; mathematical model; Mathematics and Science; MEMS sensor; metallic bonding; morphology analysis; n/a; noise suppression structures; on-chip interconnect; on-chip spiral inductor; packages; parylene; Physics; physics-based modeling; power delivery network (PDN); power/ground noise; Pt–Pt interconnection; quantum resistance; Reference, Information and Interdisciplinary subjects; reliability; reliability evaluation; Research and information: general; sensing array; silicon interposer; SiO2 and Au substrate; slow-wave transmission line (SWTL); Sn-Bi solder; spoof surface plasmon polaritons (SSPP); spoof surface plasmon polaritons (SSPPs); substrate integrated waveguide (SIW); temperature-dependent resistivity; thermal resistance; through-dielectric capacitor (TDC); through-silicon-via (TSV); transmission line model; vacuum degradation; vertical tabbed via; wearable device; wettability