APA (7th ed.) Citation

(2023). Advanced Interconnect and Packaging. MDPI - Multidisciplinary Digital Publishing Institute. https://doi.org/10.3390/books978-3-0365-6732-7

Chicago Style (17th ed.) Citation

Advanced Interconnect and Packaging. Basel: MDPI - Multidisciplinary Digital Publishing Institute, 2023. https://doi.org/10.3390/books978-3-0365-6732-7.

MLA (9th ed.) Citation

Advanced Interconnect and Packaging. MDPI - Multidisciplinary Digital Publishing Institute, 2023. https://doi.org/10.3390/books978-3-0365-6732-7.