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Physical vapor deposited AlN as scalable and reliable interconnect etch-stop less than or equal to 10nm node
Ren, He, Cheng, Yana, Cao, Yong, Guggilla, Srinivas, Kesapragada, Sree, Ye, Weifeng, Naik, Mehul
Published in Proceedings of the IEEE International Interconnect Technology Conference (01.05.2016)
Published in Proceedings of the IEEE International Interconnect Technology Conference (01.05.2016)
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Journal Article
Suppression of H2O absorption by hydrophobic-like surface of SiOx without Si-OH group
Ueda, Tetsuya, Kiso, Osamu, Abe, Shoji, Takezawa, Yasunari, Matsumaro, Kazuyuki, Suzuki, Chikashi, Toyama, Munehiro, Ogawa, Shinichi
Published in Proceedings of the IEEE International Interconnect Technology Conference (05.10.2020)
Published in Proceedings of the IEEE International Interconnect Technology Conference (05.10.2020)
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Conference Proceeding
BEOL process integration technology for 45 nm node porous low-k/copper interconnects
Matsunaga, N., Nakamura, N., Higashi, K., Yamaguchi, H., Watanabe, T., Akiyama, K., Nakao, S., Fujita, K., Miyajima, H., Omoto, S., Sakata, A., Katata, T., Kagawa, Y., Kawashima, H., Enomoto, Y., Hasegawa, T., Shibata, H.
Published in Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005 (30.08.2005)
Published in Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005 (30.08.2005)
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Conference Proceeding
Interface engineering for highly-reliable 65 nm-node Cu/ULK (k=2.6) interconnect integration
Ishii, A., Matsumoto, S., Hattori, T., Suzuki, S., Isono, S., Iwasaki, A., Tomita, K., Hashimoto, K., Tawa, S., Furusawa, T., Kodama, D., Ogawa, S., Suzumura, S., Tsutsue, M., Goto, K., Kobayashi, K., Ohshita, H., Hamada, M., Amoh, N., Okamura, H., Yonekura, K., Hamatani, T., Kobayshi, T., Tsukamoto, K., Matsuura, M.
Published in Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005 (30.08.2005)
Published in Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005 (30.08.2005)
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Conference Proceeding
Highly reliable PVD/ALD/PVD stacked barrier metal structure for 45-nm node copper dual-damascene interconnects
Higashi, K., Yamaguchi, H., Omoto, S., Sakata, A., Katata, T., Matsunaga, N., Shibata, H.
Published in Proceedings of the IEEE 2004 International Interconnect Technology Conference : Hyatt Regency Hotel, Burlingame, CA, June 7-9, 2004 (26.10.2004)
Published in Proceedings of the IEEE 2004 International Interconnect Technology Conference : Hyatt Regency Hotel, Burlingame, CA, June 7-9, 2004 (26.10.2004)
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Conference Proceeding
(Invited) Electroless Deposition of Ruthenium Using Sodium Borohydride Reducing Agent: A Mechanistic Study Using Electrochemical Quartz Crystal Microbalance
Joi, Aniruddha, Zieliene, Albina, Norkus, Eugenijus, Tamasauskaite-Tamasiunaite, Loreta, Dordi, Yezdi
Published in Meeting abstracts (Electrochemical Society) (07.07.2015)
Published in Meeting abstracts (Electrochemical Society) (07.07.2015)
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Journal Article
Chemical dry cleaning technology for reliable 65 nm CMOS contact to NiSi/sub x
Honda, M., Tsutsumi, K., Harakawa, H., Nomachi, A., Murakami, K., Ooya, K., Kudou, T., Nagamatsu, T., Ezawa, H.
Published in Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005 (30.08.2005)
Published in Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005 (30.08.2005)
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Conference Proceeding
Implementation of integratable PDMS-based conformable microelectrode arrays using a multilayer wiring interconnect technology
Liang Guo, DeWeerth, S.P.
Published in Conference proceedings (IEEE Engineering in Medicine and Biology Society. Conf.) (01.01.2009)
Published in Conference proceedings (IEEE Engineering in Medicine and Biology Society. Conf.) (01.01.2009)
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Conference Proceeding
Journal Article
Proceedings for NPL Joint Symposium on Quantum Technologies 13th and 14th September 2022
Published in Journal of physics. Conference series
(01.12.2022)
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Journal Article
Direct deposition of Cu/barrier stacks on dielectric/nonconductive layers using supercritical CO/sub 2
Kondoh, E., Hishikawa, M., Yanagihara, M., Shigama, K.
Published in Proceedings of the IEEE 2004 International Interconnect Technology Conference : Hyatt Regency Hotel, Burlingame, CA, June 7-9, 2004 (26.10.2004)
Published in Proceedings of the IEEE 2004 International Interconnect Technology Conference : Hyatt Regency Hotel, Burlingame, CA, June 7-9, 2004 (26.10.2004)
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Conference Proceeding
Low-Frequency Noise Measurements for Electromigration Characterization in BEOL Interconnects
Beyne, S., Croes, K., Pedreira, O. Varela, Arnoldi, L., van der Veen, M. H., De Wolf, I., Tokei, Zs
Published in IEEE International Integrated Reliability Workshop final report (01.10.2019)
Published in IEEE International Integrated Reliability Workshop final report (01.10.2019)
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Conference Proceeding