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Search Results - 天津市电子材料与器件重点实验室, 天津 300130
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SHA和TT-LYK在钴基阻挡层集成电路CMP中的协同作用
by
方淇
,
潘国峰
,
杨雪妍
,
胡连军
Published in
应用化工
(2024)
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超滤和活性剂协同作用对铜阻挡层CMP后缺陷的控制机理研究
by
崔志慧
,
王辰伟
,
刘玉岭
,
赵红东
,
续晨
Published in
电子元件与材料
(2022)
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抛光液添加剂协同作用对铜互连阻挡层CMP后碟形坑及蚀坑的影响
by
崔志慧
,
王辰伟
,
刘玉岭
,
赵红东
,
李红亮
Published in
电子元件与材料
(2021)
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基于CeO2掺杂ZnO的高灵敏度丙酮气体传感器
by
崔军蕊
,
潘国峰
,
杨学莉
,
朱梦雅
,
黄超
,
齐嘉城
Published in
电子元件与材料
(2020)
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CuO-TiO2气敏材料的制备及其低温丙酮气敏特性研究
by
郑洁
,
潘国峰
,
韩楠
,
肖悦
,
王如
Published in
电子元件与材料
(2019)
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咪唑提升硅片CMP速率的机理研究
by
刘德正
,
周建伟
,
罗翀
,
王辰伟
,
李丁杰
Published in
电子元件与材料
(2023)
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不同表面活性剂对浅沟槽隔离CMP中SiO2与Si3N4速率选择性的影响
by
张月
,
周建伟
,
王辰伟
,
郭峰
Published in
电子元件与材料
(2023)
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咪唑对钴互连化学机械抛光的影响
by
郭峰
,
王胜利
,
王辰伟
,
张月
Published in
电子元件与材料
(2023)
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聚丙烯酸对氧化铈抛光液稳定性能的影响研究
by
张国林
,
王胜利
,
罗翀
,
王辰伟
,
刘德正
Published in
电子元件与材料
(2023)
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络合剂在铜CMP中的研究进展及发展趋势
by
邹毅达
,
牛新环
,
闫晗
,
屈明慧
,
罗付
,
刘江皓
,
占妮
,
周建伟
Published in
应用化工
(2023)
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络合剂对铜CMP去除速率及机理的研究
by
李梦琦
,
孙鸣
,
马忠臣
Published in
应用化工
(2023)
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钌基阻挡层铜膜CMP中E1310P的缓蚀机理研究
by
孙纪元
,
周建伟
,
罗翀
,
王辰伟
,
李丁杰
Published in
电子元件与材料
(2023)
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用于钴互连CMP抛光液的研究进展
by
刘江皓
,
牛新环
,
闫晗
,
屈明慧
,
罗付
Published in
电子元件与材料
(2023)
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集成电路CMP中金属腐蚀复配缓蚀剂的研究进展
by
武峥
,
牛新环
,
何潮
,
董常鑫
,
李鑫杰
,
胡槟
,
李佳辉
Published in
半导体技术
(2025)
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低浓度CeO2/SiO2复合磨料对硅片CMP性能的影响
by
刘文博
,
王辰伟
,
罗翀
,
岳泽昊
,
王雪洁
,
邵祥清
,
李瑾
Published in
电子元件与材料
(2024)
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ATMP在钴互连集成电路钴膜CMP中的作用机理研究
by
王昊
,
黄浩真
,
曹静伟
,
夏荣阳
,
潘国峰
Published in
电子元件与材料
(2022)
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新型抑制剂对铜膜CMP后碟形坑与蚀坑的影响
by
李子豪
,
周建伟
,
王辰伟
,
马慧萍
,
张月
Published in
电子元件与材料
(2022)
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酸性层间介质CMP抛光液胶体稳定性的研究
by
陈志博
,
王辰伟
,
王雪洁
,
王海英
,
盛媛慧
Published in
电子元件与材料
(2023)
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工艺参数对阻挡层CMP后互连线厚度一致性的影响
by
王海英
,
王辰伟
,
刘玉岭
,
赵红东
Published in
电子元件与材料
(2023)
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络合剂DTPA-5K在集成电路阻挡层CMP中的应用及机理分析
by
霍兆晴
,
牛新环
,
刘玉岭
,
杨程辉
,
卢亚楠
Published in
电子元件与材料
(2021)
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