by Wang, Jicai, Chen, Fangyan
Published in Mechanics & industry : an international journal on mechanical sciences and engineering applications (2025)

by Parker, James R
Year of Publication 2021

by Radhika, Venkutuswamy, Srinivasan, Karuppanan, Sharmila, Bella Bellie, Rukkumani, Venkatasalam
Published in Analog integrated circuits and signal processing (01.05.2021)

by Winarno, Totok, Palupi, Lucky Nindya, Pracoyo, Agus, Ardhenta, Lunde
Published in Telkomnika (01.04.2020)

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by Zhao, Yuan, Xiao, Sha-Sha, Liu, Ji-Rui, Wu, Sen
Published in Sensors (Basel, Switzerland) (09.07.2025)

by Saxena, Aditi, Sharma, Kamal, Kadirgama, K., Devarajan, R., Noor, M. M.
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by Anshory, Izza, Jamaaluddin, Jamaaluddin, Wisaksono, Arief, Sulistiyowati, Indah, Hindarto, Rintyarna, Bagus Setya, Fudholi, Ahmad, Rahman, Yuli Asmi, Sopian, Kamaruzzaman
Published in Results in engineering (01.03.2024)

by GUO, J.-H, WANG, C.-L
Published in IEEE transactions on computers (01.10.1998)

by Ge, Qiang, Zhu, Jianhui, Zhang, Gang, Cui, Yanyan, Xiao, Jian, Wang, Huisheng, Wu, Xuqiang, Yu, Benli
Published in Journal of lightwave technology (15.12.2022)

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Published in International journal of distributed systems and technologies (01.04.2018)

by Wen, Sheng, Zhang, Quanyong, Deng, Jizhong, Lan, Yubin, Yin, Xuanchun, Shan, Jian
Published in Applied sciences (01.12.2018)

by Manjunath, Matam, Venugopal Reddy, Barry, Lehman, Brad
Published in IET renewable power generation (10.06.2019)

by Dong, Jinlong, Shi, Jiashun, Liu, Cong, Yu, Tianbiao
Published in Robotics and computer-integrated manufacturing (01.08.2021)

by Hay Mar Shwe, San Hay Mar, Funabiki, Nobuo, Syaifudin, Yan Watequlis, Tar, Phyu Phyu, Kyaw, Htoo Htoo Sandi, Thant, Hnin Aye, Kao, Wen-Chung, Min, Nandar Win, Myint, Thandar, Htet, Ei Ei
Published in International journal of Web information systems (06.09.2021)

by Jiang, Qinhang, Yan, Hairong
Published in IEEE Advanced Information Management, Communicates, Electronic and Automation Control Conference (IMCEC ...) (Online) (16.12.2022)

by Qi, Huiyu, Funabiki, Nobuo, Wai, Khaing Hsu, Hendryanna, Flasma Veronicha, Mon, Khin Thet, Mentari, Mustika, Kao, Wen Chung
Published in Engineering letters (01.03.2024)

by Zhang, Xuejing, He, Zishu, Liao, Bin, Zhang, Xuepan, Cheng, Ziyang, Lu, Yanxi
Published in IEEE transactions on signal processing (01.04.2017)

by Zhang, Jianxin, Li, Hailin, Ma, Kai, Xue, Liang, Han, Bianhua, Dong, Yuemeng, Tan, Yue, Gu, Chengru
Published in IOP conference series. Materials Science and Engineering (01.03.2018)

by Jinfeng, Gong, Huang, Chuyue, Zhang, Huaiquan, Liao, Shuaidong, Lin, Maolin, Wang, Zhuo
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)