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HotCluster: A Thermal-Aware Defect Recovery Method for Through-Silicon-Vias Toward Reliable 3-D ICs Systems
Dang, Khanh N., Ahmed, Akram Ben, Abdallah, Abderazek Ben, Tran, Xuan-Tu
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.04.2022)
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.04.2022)
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Journal Article
HotCluster: A Thermal-Aware Defect Recovery Method for Through-Silicon-Vias Toward Reliable 3-D ICs Systems
Khanh N. Dang, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran
Published in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (01.04.2022)
Published in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (01.04.2022)
Get full text
Journal Article