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HotCluster: A Thermal-Aware Defect Recovery Method for Through-Silicon-Vias Toward Reliable 3-D ICs Systems
Dang, Khanh N., Ahmed, Akram Ben, Abdallah, Abderazek Ben, Tran, Xuan-Tu
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.04.2022)
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.04.2022)
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Journal Article
HotCluster: A Thermal-Aware Defect Recovery Method for Through-Silicon-Vias Toward Reliable 3-D ICs Systems
Khanh N. Dang, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran
Published in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (01.04.2022)
Published in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (01.04.2022)
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Journal Article
Automated Indoor Drone Flight with Collision Prevention
Lagmay, Jay Mark S., Jed C. Leyba, Lionel, Santiago, Alessandro T., Tumabotabo, Lea B., Limjoco, Wilbert Jethro R., Michael C. Tiglao, Nestor
Published in TENCON ... IEEE Region Ten Conference (01.10.2018)
Published in TENCON ... IEEE Region Ten Conference (01.10.2018)
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