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    Process Development of Void Free Underfilling for Flip-chip-on-board
                                      
                                            Ming Ying,                              Tengh, A.,                              Yew Choon Chia,                              Mohtar, A.,                              Pak Wing Wong                              
Published in 2007 9th Electronic Packaging Technology Conference (01.12.2007)
                   
      
      
                                                  Published in 2007 9th Electronic Packaging Technology Conference (01.12.2007)
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              Conference Proceeding
          
              
          FILLED AND UNFILLED UNDERGROUND VOIDS EVALUATION USING ELECTRICAL RESISTIVITY METHOD
                                      
                                            Chitea, Florina,                              Stanciu, Irina-Marilena,                              Ioane, Dumitru                              
Published in International Multidisciplinary Scientific GeoConference SGEM (01.01.2019)
                   
      
      
                                                  Published in International Multidisciplinary Scientific GeoConference SGEM (01.01.2019)
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              Conference Proceeding