Vyzkoušejte nový nástroj s podporou AI
Summon Research Assistant
BETA
Novel approach to fabricating carbon nanotube via interconnects using size-controlled catalyst nanoparticles
Sato, S., Nihei, M., Mimura, A., Kawabata, A., Kondo, D., Shioya, H., Iwai, T., Mishima, M., Ohfuti, M., Awano, Y.
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Get full text
Conference Proceeding
On-Chip Copper-Based vs. Optical Interconnects: Delay Uncertainty, Latency, Power, and Bandwidth Density Comparative Predictions
Guoqing Chen, Hui Chen, Haurylau, M., Nelson, N.A., Albonesi, D.H., Fauchet, P.M., Friedman, E.G.
Published in 2006 International Interconnect Technology Conference (2006)
Published in 2006 International Interconnect Technology Conference (2006)
Get full text
Conference Proceeding
Physical, Electrical, and Reliability Characterization of Ru for Cu Interconnects
Yang, C.-C., Spooner, T., Ponoth, S., Chanda, K., Simon, A., Lavoie, C., Lane, M., Hu, C.-K., Liniger, E., Gignac, L., Shaw, T., Cohen, S., McFeely, F., Edelstein, D.
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Get full text
Conference Proceeding
Ruthenium interconnects with 58 nm2 cross-section area using a metal-spacer process
Dutta, Shibesh, Kundu, Shreya, Lianggong Wen, Jamieson, Geraldine, Croes, Kristof, Gupta, Anshul, Bommels, Jurgen, Wilson, Christopher J., Adelmann, Christoph, Tokei, Zsolt
Published in Proceedings of the IEEE International Interconnect Technology Conference (01.05.2017)
Published in Proceedings of the IEEE International Interconnect Technology Conference (01.05.2017)
Get full text
Conference Proceeding
Cu Alloy Metallization for Self-Forming Barrier Process
Koike, J., Haneda, M., Iijima, J., Wada, M.
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Get full text
Conference Proceeding
Challenges to via middle TSV integration at sub-28nm nodes
Kamineni, Himani Suhag, Kannan, Sukeshwar, Alapati, Ramakanth, Thangaraju, Sarasvathi, Smith, Daniel, Dingyou Zhang, Shan Gao
Published in Proceedings of the IEEE International Interconnect Technology Conference (01.05.2014)
Published in Proceedings of the IEEE International Interconnect Technology Conference (01.05.2014)
Get full text
Conference Proceeding
UV/EB Cure Mechanism for Porous PECVD/SOD Low-k SiCOH Materials
Nakao, S.-I., Ushio, J., Ohno, T., Hamada, T., Kamigaki, Y., Kato, M., Yoneda, K., Kondo, S., Kobayashi, N.
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Get full text
Conference Proceeding
Effects of Chip-Package Interaction on Mechanical Reliability of Cu Interconnects for 65nm Technology Node and Beyond
Uchibori, C.J., Xuefeng Zhang, Ho, P.S., Nakamura, T.
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Get full text
Conference Proceeding
Performance Comparison of Interconnect Technology and Architecture Options for Deep Submicron Technology Nodes
Bamal, M., List, S., Stucchi, M., Verhulst, A.S., Van Hove, M., Cartuyvels, R., Beyer, G., Maex, K.
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Get full text
Conference Proceeding
High Performance Ultra Low-k (k=2.0/keff=2.4)/Cu Dual-Damascene Interconnect Technology with Self-Formed MnSixOy Barrier Layer for 32 nm-node
Usui, T., Tsumura, K., Nasu, H., Hayashi, Y., Minamihaba, G., Toyoda, H., Sawada, H., Ito, S., Miyajima, H., Watanabe, K., Shimada, M., Kojima, A., Uozumi, Y., Shibata, H.
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Get full text
Conference Proceeding
Direct CMP on Porous Low-k Film for Damage-less Cu Integration
Kondo, S., Fukaya, K., Ohashi, N., Miyazaki, T., Nagano, H., Wada, Y., Ishibashi, T., Kato, M., Yoneda, K., Soda, E., Nakao, S., Ishigami, K., Kobayashi, N.
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Get full text
Conference Proceeding
Cobalt fill for advanced interconnects
Bekiaris, Nikolaos, Zhiyuan Wu, Ren, He, Naik, Mehul, Jin Hee Park, Lee, Mark, Tae Hong Ha, Wenting Hou, Bakke, Jonathan R., Gage, Max, You Wang, Jianshe Tang
Published in Proceedings of the IEEE International Interconnect Technology Conference (01.05.2017)
Published in Proceedings of the IEEE International Interconnect Technology Conference (01.05.2017)
Get full text
Conference Proceeding
Simulation-Based Process Optimization for Maximizing Device Area and Integration Efficiency in Elevated-Epitaxy Technique for Monolithic 3D ICs
Chen, Yu-Chun, Chen, Ching-Lin, Pan, Yu-Ming, Yang, Chih-Chao, Shen, Chang-Hong, Chen, Kuan-Neng, Hu, Chenming
Published in Proceedings of the IEEE International Interconnect Technology Conference (02.06.2025)
Published in Proceedings of the IEEE International Interconnect Technology Conference (02.06.2025)
Get full text
Conference Proceeding
Innovations Enabling the Continued Extendibility of Cu and Post-Cu Damascene BEOL Technologies
Edelstein, D., Jog, A., Nguyen, S., Huang, H., Ghosh, S., Choi, S., Lanzillo, N., Lofaro, M., McDermott, S., Metzler, D., Mignot, Y., Nogami, T., Petrescu, F., Shoudy, M., Silvestre, M., Simon, A., Wangoh, L., Zhang, H., Choi, K.
Published in Proceedings of the IEEE International Interconnect Technology Conference (02.06.2025)
Published in Proceedings of the IEEE International Interconnect Technology Conference (02.06.2025)
Get full text
Conference Proceeding
Study of Resistivity Reduction by Annealing with a Choice of Complexing Agent in Electroless Plated Ru
Hamamura, Takanobu, Ishii, Yuko, Shimizu, Tomohiro, Ito, Takeshi, Fukumuro, Naoki, Yae, Shinji, Shingubara, Shoso
Published in Proceedings of the IEEE International Interconnect Technology Conference (02.06.2025)
Published in Proceedings of the IEEE International Interconnect Technology Conference (02.06.2025)
Get full text
Conference Proceeding
Advanced Patterning: Tackling the big problems in printing small features
Eynon, Benjamin G.
Published in Proceedings of the IEEE International Interconnect Technology Conference (02.06.2025)
Published in Proceedings of the IEEE International Interconnect Technology Conference (02.06.2025)
Get full text
Conference Proceeding
Bevel Engineering in Advanced Packaging
Kim, Keechan, Keovisai, Moty
Published in Proceedings of the IEEE International Interconnect Technology Conference (02.06.2025)
Published in Proceedings of the IEEE International Interconnect Technology Conference (02.06.2025)
Get full text
Conference Proceeding
Impact of Redundancy and Line Extension on Short-Length Effect in Electromigration Reliability
Esposto, Simone, Ciofi, Ivan, Sisto, Giuliano, Croes, Kristof, Milojevic, Dragomir, Zahedmanesh, Houman
Published in Proceedings of the IEEE International Interconnect Technology Conference (02.06.2025)
Published in Proceedings of the IEEE International Interconnect Technology Conference (02.06.2025)
Get full text
Conference Proceeding