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An Efficient Simulation Methodology to Quantify the Impact of Parameter Fluctuations on the Electrothermal Behavior of Multichip SiC Power Modules
Breglio, Giovanni, Borghese, Alessandro, Maresca, Luca, d'Alessandro, Vincenzo, Codecasa, Lorenzo, Catalano, Antonio Pio, Fayyaz, Asad, Riccio, Michele, Castellazzi, Alberto, Irace, Andrea
Published in Materials science forum (19.07.2019)
Published in Materials science forum (19.07.2019)
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Book Chapter
Journal Article
Long-Term Reliability Evaluation of Power Modules With Low Amplitude Thermomechanical Stresses and Initial Defects
Hu, Borong, Konaklieva, Sylvia, Kourra, Nadia, Williams, Mark A., Ran, Li, Lai, Wei
Published in IEEE journal of emerging and selected topics in power electronics (01.02.2021)
Published in IEEE journal of emerging and selected topics in power electronics (01.02.2021)
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Journal Article
PROCESS FOR PRODUCING SUBSTRATE FOR POWER MODULE, SUBSTRATE FOR POWER MODULE, AND POWER MODULE
KUROMITSU, Yoshirou, NAGASE, Toshiyuki, NAGATOMO, Yoshiyuki, KITAHARA, Takeshi
Year of Publication 01.02.2017
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Year of Publication 01.02.2017
Patent
Multibranch Inductance Extraction Procedure for Multichip Power Modules
Shahabi, Ali, Lemmon, Andrew N.
Published in IEEE journal of emerging and selected topics in power electronics (01.03.2020)
Published in IEEE journal of emerging and selected topics in power electronics (01.03.2020)
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Journal Article
Power module substrate, power module, and method for manufacturing power module substrate
KUROMITSU YOSHIROU, TONOMURA HIROSHI, AKIYAMA KAZUHIRO, KITAHARA TAKESHI
Year of Publication 04.08.2015
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Year of Publication 04.08.2015
Patent
Power module substrate, power module, and method for manufacturing power module substrate
KUROMITSU YOSHIROU, TONOMURA HIROSHI, AKIYAMA KAZUHIRO, KITAHARA TAKESHI
Year of Publication 28.07.2015
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Year of Publication 28.07.2015
Patent