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Long-Term Reliability Evaluation of Power Modules With Low Amplitude Thermomechanical Stresses and Initial Defects
Hu, Borong, Konaklieva, Sylvia, Kourra, Nadia, Williams, Mark A., Ran, Li, Lai, Wei
Published in IEEE journal of emerging and selected topics in power electronics (01.02.2021)
Published in IEEE journal of emerging and selected topics in power electronics (01.02.2021)
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Journal Article
Temperature-Aware Sizing of Multi-Chip Module Accelerators for Multi-DNN Workloads
Shukla, Prachi, Aguren, Derrick, Burd, Tom, Coskun, Ayse K., Kalamatianos, John
Published in Proceedings - Design, Automation, and Test in Europe Conference and Exhibition (01.04.2023)
Published in Proceedings - Design, Automation, and Test in Europe Conference and Exhibition (01.04.2023)
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Conference Proceeding
Low temperature Cu sinter joining on different metallization substrates and its reliability evaluation with a high current density
Chen, Chuantong, Iwaki, Aya, Suetake, Aiji, Sugiura, Kazuhiko, Kanie, Kiyoshi, Suganuma, Katsuaki
Published in Proceedings of the International Symposium on Power Semiconductor Devices & ICs (30.05.2021)
Published in Proceedings of the International Symposium on Power Semiconductor Devices & ICs (30.05.2021)
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Conference Proceeding
Evaluation of Active Capacitor Bank for Floating H-bridge Power Modules
Nguyen, Tam K.T., Wen, Bo, Burgos, Rolando, Boroyevich, Dushan, Verhulst, Jacob, Vrtachnik, David L., Belkhayat, Mohamed
Published in Conference proceedings - IEEE Applied Power Electronics Conference and Exposition (01.03.2020)
Published in Conference proceedings - IEEE Applied Power Electronics Conference and Exposition (01.03.2020)
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Conference Proceeding
A Study on Wafer Bonding Methods for Small-Scale Samples under Non-Cleanroom Conditions
Xie, Zixian, Li, Han, Gong, Yi, Shu, Shuai, Li, Junsheng, Guo, Min
Published in 2025 4th International Symposium on Semiconductor and Electronic Technology (ISSET) (24.07.2025)
Published in 2025 4th International Symposium on Semiconductor and Electronic Technology (ISSET) (24.07.2025)
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Conference Proceeding
Suppression of Partial Discharge in Package Insulation Under Square-Wave Voltage by Plasma-Enhanced Film Deposition
Guan, Xiuhan, Zhang, Fengjie, Xu, Junhao, Cheng, Hongtu, Wang, Yalin, Zhu, Xi, Fang, Zhi
Published in International Conference on Electrical Materials and Power Equipment (Online) (03.08.2025)
Published in International Conference on Electrical Materials and Power Equipment (Online) (03.08.2025)
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Conference Proceeding
Partial Discharge in High Voltage PCBs
Pompa, Matthew J., Lemmon, Andrew N.
Published in Integrated Power Packaging (IWIPP), IEEE International Workshop on (08.04.2025)
Published in Integrated Power Packaging (IWIPP), IEEE International Workshop on (08.04.2025)
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Conference Proceeding
A Data-Driven Approach for Power IGBT Operation State Prediction Based on Domain Adapted BiLSTM Networks
Deng, Shuhan, Li, Weihua, Yue, Ke, Li, Jipu, Huang, Ruyi, Chen, Zhuyun
Published in 2023 International Conference on Sensing, Measurement & Data Analytics in the era of Artificial Intelligence (ICSMD) (02.11.2023)
Published in 2023 International Conference on Sensing, Measurement & Data Analytics in the era of Artificial Intelligence (ICSMD) (02.11.2023)
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Conference Proceeding
Diagnosing IGBT Module Degradation by Frequency-domain Heat Flow Analysis
Xu, Mengqi, Cai, Tianle, Ma, Ke, Zhou, Dangsheng, Wang, Sufei, Wu, Tianhao
Published in IEEE Energy Conversion Congress and Exposition (29.10.2023)
Published in IEEE Energy Conversion Congress and Exposition (29.10.2023)
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Conference Proceeding
Prognostic System for Power-Electronic IGBT Modules in Electric, Hybrid Electric and Fuel-Cell Vehicles Using Machine Learning
Jain, Anushka, Senthil Kumar, Aarthi Shree, Mahajan, Suhani, Selukar, Chinmayee Someshwar, Atul Mudgal, Shreya, Doshi, Tanishq, Radhika, Sudha
Published in 2023 16th International Conference on Sensing Technology (ICST) (17.12.2023)
Published in 2023 16th International Conference on Sensing Technology (ICST) (17.12.2023)
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Conference Proceeding
Analysis and Mitigation of Common Mode Current in SiC MOSFET Gate Driver Power Supply
Gill, Lee, Ikari, Takayuki
Published in 2018 IEEE International Conference on Electrical Systems for Aircraft, Railway, Ship Propulsion and Road Vehicles & International Transportation Electrification Conference (ESARS-ITEC) (01.11.2018)
Published in 2018 IEEE International Conference on Electrical Systems for Aircraft, Railway, Ship Propulsion and Road Vehicles & International Transportation Electrification Conference (ESARS-ITEC) (01.11.2018)
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Conference Proceeding
An approach for failure prediction in H3 TRB-tests
Kolbinger, Elisabeth, Wuest, Felix, Dijk, Marius van, Trampert, Stefan, Lang, Klaus-Dieter
Published in 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) (01.09.2019)
Published in 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) (01.09.2019)
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Conference Proceeding