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Analytical modeling of thermo-mechanical stress for bond wire of IGBT module
Dai, Xingyu, Yang, Xin, Wu, Xinlong, Tu, Chunming, Liu, Guoyou
Published in Microelectronics and reliability (01.12.2021)
Published in Microelectronics and reliability (01.12.2021)
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Journal Article
Diagnosing IGBT Module Degradation by Frequency-domain Heat Flow Analysis
Xu, Mengqi, Cai, Tianle, Ma, Ke, Zhou, Dangsheng, Wang, Sufei, Wu, Tianhao
Published in IEEE Energy Conversion Congress and Exposition (29.10.2023)
Published in IEEE Energy Conversion Congress and Exposition (29.10.2023)
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Conference Proceeding
Solder Selection Simulation Of IGBT Module Based On Thermal - Mechanical Coupling Field
Liu, Bowen, Chen, Jibing, Hu, Maohui, Chen, Junsheng, Shi, Qianyu, Hong, Yifei
Published in International Conference on Electronic Packaging Technology (Online. 2013) (08.08.2023)
Published in International Conference on Electronic Packaging Technology (Online. 2013) (08.08.2023)
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Conference Proceeding
Research on Failure Mechanism and Health Evaluation Index System of Welding IGBT Module
Dang, Luzhi, Yang, Kai, Zhang, Qingping, Kang, Yongqiang, Li, Shuaibing, Li, Hongwei
Published in 2022 3rd International Conference on Advanced Electrical and Energy Systems (AEES) (23.09.2022)
Published in 2022 3rd International Conference on Advanced Electrical and Energy Systems (AEES) (23.09.2022)
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Conference Proceeding
A Numerical Procedure for the Optimization of IGBT Module Packaging
Lu, Hua, Rajaguru, Pushparajah, Bailey, Chris
Published in 2018 19th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2018)
Published in 2018 19th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2018)
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Conference Proceeding
Combined experimental- and FE-studies on sinter-Ag behaviour and effects on IGBT-module reliability
Dudek, R., Doring, R., Sommer, P., Seiler, B., Kreyssig, K., Walter, H., Becker, M., Gunther, M.
Published in EuroSimE : 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems : 7-9 April 2014 (01.04.2014)
Published in EuroSimE : 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems : 7-9 April 2014 (01.04.2014)
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Conference Proceeding
Electro-thermo-mechanical analyses on silver sintered IGBT-module reliability in power cycling
Dudek, R., Doring, R., Rzepka, S., Ehrhardt, C., Gunther, M., Haag, M.
Published in 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2015)
Published in 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2015)
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Conference Proceeding
IGBT module construction
COLELLO; GARY M, SALTER, II; RICHARD T, MILLAS; GARY P, DONEGAN; KEVIN J
Year of Publication 13.07.1999
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Year of Publication 13.07.1999
Patent
Heat dissipation structure of IGBT module with pin fins and electric automobile control box
LIU PENGFEI, SHEN DINGJIAN, LIU CHUANDE, MAO JINPING, TAN ZHAO, LIU WEILIANG, WU ZHEN, CHEN JIANMING, YANG YINBO, WU ZUOLAI, LI SHAOLONG, ZHOU CHENG
Year of Publication 05.04.2017
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Year of Publication 05.04.2017
Patent
Wind power converter IGBT module junction temperature online computing method
LIU ZHIXIANG, LI HUI, QIN XING, LIU SHENGQUAN, YANG DONG, LI YANG, CHEN YAOJUN, LIANG YUANYUAN, MENG LI, JI HAITING
Year of Publication 30.07.2014
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Year of Publication 30.07.2014
Patent
METHOD OF SWITCHING OVERVOLTAGE PROTECTION OF RECTIFIER UNIT FOR ELECTRIC LOCOMOTIVE EXCITEMENT BASED ON IGBT MODULE AND RECTIFIER UNIT FOR ELECTRIC LOCOMOTIVE EXCITEMENT
MEL'NICHENKO OLEG VALER'EVICH, SHRAMKO SERGEJ GENNAD'EVICH, PORTNOJ ALEKSANDR JUR'EVICH, LIN'KOV ALEKSEJ OLEGOVICH
Year of Publication 20.10.2015
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Year of Publication 20.10.2015
Patent
A Junction Temperature Monitoring Method for IGBT Modules Based on Turn-Off Voltage With Convolutional Neural Networks
Wang, Huimin, Xu, Zhiliang, Ge, Xinglai, Liao, Yongkang, Yang, Yongheng, Zhang, Yi, Yao, Bo, Chai, Yuheng
Published in IEEE transactions on power electronics (01.08.2023)
Published in IEEE transactions on power electronics (01.08.2023)
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Journal Article
A Vectorial Current Density Visual Inspection Method for IGBT Modules
Wu, Yangjing, Li, Hangcheng, He, Yichen, Li, Jing, Su, Huiyi, Shi, Chengyu, Zhang, Wenwei, Zhang, Mingji
Published in IEEE transactions on electron devices (01.09.2024)
Published in IEEE transactions on electron devices (01.09.2024)
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Journal Article
The influence of humidity on the high voltage blocking reliability of power IGBT modules and means of protection
Papadopoulos, Charalampos, Corvasce, Chiara, Kopta, Arnost, Schneider, Daniel, Pâques, Gontran, Rahimo, Munaf
Published in Microelectronics and reliability (01.09.2018)
Published in Microelectronics and reliability (01.09.2018)
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Journal Article