Vyzkoušejte nový nástroj s podporou AI
Summon Research Assistant
BETA
Large Scale 3D Topology Optimization of Conjugate Heat Transfer
Sun, Sicheng, Liebersbach, Piotr, Qian, Xiaoping
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.05.2019)
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.05.2019)
Get full text
Conference Proceeding
Evolution of the Mechanical Behavior of Lead Free Solders Exposed to Thermal Cycling
Kamrul Hasan, S. M., Fahim, Abdullah, Suhling, Jeffrey C., Hamasha, Sa'd, Lall, Pradeep
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.05.2019)
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.05.2019)
Get full text
Conference Proceeding
Investigation of Aging Induced Microstructural Changes in Doped SAC+X Solders
Wu, Jing, Ahmed, Sudan, Suhling, Jeffrey C., Lall, Pradeep
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.05.2019)
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.05.2019)
Get full text
Conference Proceeding
Cooling for Electric Aircraft Motors
McCluskey, F. Patrick, Saadon, Yonatan, Yao, Zhaoxi, Camacho, Alexander
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.05.2019)
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.05.2019)
Get full text
Conference Proceeding
Additive Manufacturing of Compact Manifold-Microchannel Heat Exchangers Utilizing Direct Metal Laser Sintering
Keramati, Hadi, Battaglia, Fabio, Arie, Martinus A., Singer, Farah, Ohadi, Michael M.
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.05.2019)
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.05.2019)
Get full text
Conference Proceeding
Experimental Demonstration of an Additively Manufactured Vapor Chamber Heat Spreader
Ozguc, Serdar, Pai, Saeel, Pan, Liang, Geoghegan, Patrick J., Weibel, Justin A.
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.05.2019)
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.05.2019)
Get full text
Conference Proceeding
Effect of Shock Angle on Solder-Joint Reliability of Potted Assemblies Under High-G Shock
Lall, Pradeep, Pandurangan, Aathi Raja Ram, Dornala, Kalyan, Suhling, Jeff, Deep, John
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.07.2020)
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.07.2020)
Get full text
Conference Proceeding
3-D Numerical Multiphysics Model for Cu-Al Wire Bond Corrosion
Lall, Pradeep, Zhang, Yunli, Suhling, Jeff, Nguyen, Luu
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.05.2019)
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.05.2019)
Get full text
Conference Proceeding
Effect of Different Thermal Cycling Profiles on the Mechanical Behavior of SAC305 Lead Free Solder
Al Ahsan, Mohammad, Kamrul Hasan, S.M., Fahim, Abdullah, Suhling, Jeffrey C., Lall, Pradeep
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.07.2020)
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.07.2020)
Get full text
Conference Proceeding
Effect of Sintering Temperature on the Fatigue Life of Additively Printed Electronics During Cyclic Bending
Lall, Pradeep, Narangaparambil, Jinesh, Leever, Ben, Miller, Scott
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.05.2019)
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.05.2019)
Get full text
Conference Proceeding
Pool Boiling Experiment of Dielectric Liquids and Numerical Study for Cooling a Microprocessor
Ghaffari, Omidreza, Grenier, Francis, Morissette, Jean-Francois, Bolduc, Martin, Jasmin, Simon, Sylvestre, Julien
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.05.2019)
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.05.2019)
Get full text
Conference Proceeding
Convergence and Validation in ParaPower: A Design Tool for Phase Change Materials in Electronics Packaging
Deckard, Michael, Shamberger, Patrick, Fish, Michael, Berman, Morris, Wang, Justin, Boteler, Lauren
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.05.2019)
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.05.2019)
Get full text
Conference Proceeding
Theoretical Investigation of Boundary Layer Behavior and Heat Transfer of Supercritical Carbon Dioxide (sCO2) in a Microchannel
Manda, Uday, Parahovnik, Anatoly, Peles, Yoav
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.07.2020)
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.07.2020)
Get full text
Conference Proceeding
Spatially-Varying Electrothermal Impedance Analysis for Designing Power Semiconductor Converter Systems
Polom, Timothy A., van der Broeck, Christoph H., De Doncker, Rik W., Lorenz, Robert D.
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.05.2019)
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.05.2019)
Get full text
Conference Proceeding
Evolution of Anand Parameters for SAC-Q Solder Alloy after Prolonged Storage up to 1-Year at High Strain Rate at Very High Operating Temperature
Lall, Pradeep, Yadav, Vikas, Suhling, Jeff, Locker, David
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.05.2019)
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.05.2019)
Get full text
Conference Proceeding
Effect of Aging on the Fatigue Life and Shear Strength of SAC305 Solder Joints in Actual Setting Conditions
Athamneh, Raed Al, Abueed, Mohammed, Hani, Dania Bani, Su, Sinan, Hamasha, Sa'd, Suhling, Jeffery, Lall, Pradeep
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.05.2019)
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.05.2019)
Get full text
Conference Proceeding
Topology Optimization of Manifold Microchannel Heat Sinks
Zhou, Yuqing, Nomura, Tsuyoshi, Dede, Ercan M.
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.07.2020)
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.07.2020)
Get full text
Conference Proceeding