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Communication-Defect-Free Filling of High Aspect Ratio Through Vias in Ultrathin Glass
Chang, Yiu-Hsiang, Tseng, Pei-Lien, Lin, Jen-Chieh, Chen, Jie-Chi, Huang, Meng-Chi, Lin, Hung-Yi, Pollard, Scott, Mazumder, Prantik
Published in Journal of the Electrochemical Society (2019)
Published in Journal of the Electrochemical Society (2019)
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Journal Article
Self-assembled monolayer-immobilized gold nanoparticles for WO3/TiO2 nanocomposite films to yield remarkably enhanced ultraviolet and visible-light photocatalytic activity
Chen, Giin-Shan, Chiu, Sheng-Kuei, Li, Wei-Cheng, Lee, Wei, Chang, Yiu-Hsiang
Published in Materials letters (15.03.2022)
Published in Materials letters (15.03.2022)
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Journal Article
Enhancement of Electromigration Reliability of Electroless-Plated Nanoscaled Copper Interconnects by Complete Encapsulation of a 1 nm-Thin Self-Assembled Monolayer
Chen, Giin-Shan, Lee, Ching-En, Cheng, Yi-Lung, Fang, Jau-Shiung, Hsiao, Chien-Nan, Chen, Wei-Chun, Chang, Yiu-Hsiang, Pan, Yen-Chang, Lee, Wei, Su, Ting-Hsun
Published in Journal of the Electrochemical Society (01.08.2022)
Published in Journal of the Electrochemical Society (01.08.2022)
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Journal Article
Activation of amino-based monolayers for electroless metallization of high-aspect-ratio through-silicon vias by using a simple ultrasonic-assisted plating solution
Chen, Sung-Te, Cheng, Yu-Syun, Chang, Yiu-Hsiang, Yang, Tzu-Ming, Lee, Jyun-Ting, Chen, Giin-Shan
Published in Applied surface science (15.05.2018)
Published in Applied surface science (15.05.2018)
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Journal Article
All-Solution-Processed Metallization of High Aspect Ratio Through Glass Vias (HAR-TGVs) with a High Adhesion Promoting Layer (APL)
Chang, Yiu-Hsiang, Wang, Wei-Yen, Tseng, Pei-Lien, Kanungo, Mandakini, Pollard, Scott C., Mazumder, Prantik
Published in Proceedings of technical papers (International Microsystems, Packaging, Assembly, and Circuits Technology Conference. Print) (25.10.2023)
Published in Proceedings of technical papers (International Microsystems, Packaging, Assembly, and Circuits Technology Conference. Print) (25.10.2023)
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Conference Proceeding
Optimization of High Aspect Ratio Through Glass Vias Void-Free Filling Using Complex System Response Platform
FU, Yu-Ting, Chang, Yiu-Hsiang, Ho, Chih-Ming, Yao, Da-Jeng
Published in Proceedings of technical papers (International Microsystems, Packaging, Assembly, and Circuits Technology Conference. Print) (22.10.2024)
Published in Proceedings of technical papers (International Microsystems, Packaging, Assembly, and Circuits Technology Conference. Print) (22.10.2024)
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Conference Proceeding
얇은 유리 상의 유리-관통 비아를 위한 구리 금속화
POLLARD SCOTT CHRISTOPHER, LIN JEN CHIEH, MAZUMDER PRANTIK, CHANG YIU HSIANG, TSENG PEI LIEN
Year of Publication 02.06.2021
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Year of Publication 02.06.2021
Patent
Process integration of 3D Si interposer with double-sided active chip attachments
Pei-Jer Tzeng, Lau, John H., Chau-Jie Zhan, Yu-Chen Hsin, Po-chih Chang, Yiu-Hsiang Chang, Jui-Chin Chen, Shang-Chun Chen, Chien-Ying Wu, Ching-Kuan Lee, Hsiang-Hung Chang, Chun-Hsien Chien, Cha-Hsin Lin, Tzu-Kun Ku, Ming-Jer Kao, Ming Li, Cline, Julia, Saito, Keisuke, Ji, Mandy
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
Low-cost 3DIC process technologies for wide-I/O memory cube
Jui-Chin Chen, Erh-Hao Chen, Pei-Jer Tzeng, Cha-Hsin Lin, Chung-Chih Wang, Shang-Chun Chen, Tzu-Chien Hsu, Chien-Chou Chen, Yu-Chen Hsin, Po-Chih Chang, Yiu-Hsiang Chang, Tzu-Kun Ku
Published in Proceedings of technical papers - International Symposium on VLSI Technology, Systems, and Applications (01.04.2015)
Published in Proceedings of technical papers - International Symposium on VLSI Technology, Systems, and Applications (01.04.2015)
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Conference Proceeding
Fine-pitch backside via-last TSV process with optimization on temporary glue and bonding conditions
Erh-Hao Chen, Tzu-Chien Hsu, Cha-Hsin Lin, Pei-jer Tzeng, Chung-Chih Wang, Shang-Chun Chen, Jui-Chin Chen, Chien-Chou Chen, Yu-Chen Hsin, Po-Chih Chang, Yiu-Hsiang Chang, Shin-Chiang Chen, Yu-Ming Lin, Sue-Chen Liao, Tzu-Kun Ku
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
Challenges of Cu CMP of TSVs and RDLs fabricated from the backside of a thin wafer
Jui-Chin Chen, Lau, John H., Tzu-Chien Hsu, Chien-Chou Chen, Pei-Jer Tzeng, Po-Chih Chang, Chun-Hsien Chien, Yiu-Hsiang Chang, Shang-Chun Chen, Yu-Chen Hsin, Sue-Chen Liao, Cha-Hsin Lin, Tzu-Kun Ku, Ming-Jer Kao
Published in 2013 IEEE International 3D Systems Integration Conference (3DIC) (01.10.2013)
Published in 2013 IEEE International 3D Systems Integration Conference (3DIC) (01.10.2013)
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Conference Proceeding
Technologies and challenges of fine-pitch backside via-last 3DIC TSV process integration and its electrical characteristics and system applications
Erh-Hao Chen, Tzu-Chien Hsu, Cha-Hsin Lin, Pei-jer Tzeng, Chung-Chih Wang, Shang-Chun Chen, Jui-Chin Chen, Chien-Chou Chen, Yu-Chen Hsin, Po-Chih Chang, Yiu-Hsiang Chang, Shin-Chiang Chen, Yu-Ming Lin, Sue-Chen Liao, Cheng-Ta Ko, Chau-Jie Zhan, Hsiang-Hung Chang, Chun-Hsien Chien, Yung-Fa Chou, Ding-Ming Kwai, Wei-Chung Lo, Tzu-Kun Ku, Ming-Jer Kao
Published in Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) (01.04.2014)
Published in Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) (01.04.2014)
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Conference Proceeding
Study of TSV filling performance with wide-range pattern densities by using a novel plating chamber with surface paddle agitation
Shang-Chun Chen, Yiu-Hsiang Chang, Yu-Chen Hsin, Chien-Chou Chen, Jui-Chin Chen, Po-chih Chang, Pei-Jer Tzeng, Sue-Chen Liao, Shin-Chiang Chen, Chung-Chih Wang, Tzu-Chien Hsu, Yu-Ming Lin, Erh-Hao Chen, Cha-Hsin Lin, Tzu-Kun Ku
Published in 2013 International Symposium on VLSI Technology, Systems and Application (01.04.2013)
Published in 2013 International Symposium on VLSI Technology, Systems and Application (01.04.2013)
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Conference Proceeding
A novel fabrication process and measurement results of a 28GHz glass antenna with single TGV for 5G communication applications
Chang, Yiu-Hsiang, Chen, Jie-Chi, Chung, Wei, Li, Wei-Yu, Shih, Po-Tsung Boris, Ng'oma, Anthony, Yang, Chieh, Huang, Meng-Chi, Lin, Hung-Yi, Wang, Chia-Hsuan, Huang, Hou-Tzu, Kim, Cheolbok
Published in Proceedings of technical papers (International Microsystems, Packaging, Assembly, and Circuits Technology Conference. Print) (01.10.2019)
Published in Proceedings of technical papers (International Microsystems, Packaging, Assembly, and Circuits Technology Conference. Print) (01.10.2019)
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Conference Proceeding
Backside-TSV process development and integration for 2∼3um small size TSV
Tzu-Chien Hsu, Po-Chih Chang, Chung-Chih Wang, Yiu-Hsiang Chang, Tsuen-Sung Chen, Yu-Chen Hsin, Jui-Chin Chen, Yuan-Chang Lee, Shang-Chun Chen, Jen-Chun Wang, Chao-Kai Hsu, Su-Hsin Lin, Chiung-Yu Lo, Hsiang-Hung Chang, Chih-Lin Wang
Published in Proceedings of technical papers (International Microsystems, Packaging, Assembly, and Circuits Technology Conference. Print) (01.10.2016)
Published in Proceedings of technical papers (International Microsystems, Packaging, Assembly, and Circuits Technology Conference. Print) (01.10.2016)
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Conference Proceeding
Implementation of memory stacking on logic controller by using 3DIC 300mm backside TSV process integration
Chen, Shang-Chun, Tzeng, Pei-Jer, Hsm, Yu-Chen, Wang, Chung-Chih, Chang, Po-Chih, Chen, Jui-Chm, Chang, Yiu-Hsiang, Chen, Tsuen-Sung, Hsu, Tzu-Chien, Chang, Hsiang-Hung, Zhan, Chau-Jie, Lee, Chia-Hsin, Chou, Yung-Fa, Kwai, Ding-Ming, Ku, Tzu-Kun, Wang, Pei-Hua, Lo, Wei-Chung
Published in 2016 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) (01.04.2016)
Published in 2016 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) (01.04.2016)
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Conference Proceeding
An innovative bumpless stacking with through silicon via for 3D Wafer-on-Wafer (WOW) integration
Sue-Chen Liao, Erh-Hao Chen, Chien-Chou Chen, Shang-Chun Chen, Jui-Chin Chen, Po-Chih Chang, Yiu-Hsiang Chang, Cha-Hsin Lin, Tzu-Kun Ku, Ming-Jer Kao, Young Suk Kim, Maeda, Nobuhide, Kodama, Shoichi, Kitada, Hideki, Fujimoto, Koji, Ohba, Takayuki
Published in Proceedings / Electronic Components Conference (01.05.2014)
Published in Proceedings / Electronic Components Conference (01.05.2014)
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Conference Proceeding