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Temperature-Aware Sizing of Multi-Chip Module Accelerators for Multi-DNN Workloads
Shukla, Prachi, Aguren, Derrick, Burd, Tom, Coskun, Ayse K., Kalamatianos, John
Published in Proceedings - Design, Automation, and Test in Europe Conference and Exhibition (01.04.2023)
Published in Proceedings - Design, Automation, and Test in Europe Conference and Exhibition (01.04.2023)
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Conference Proceeding
Bringing 3D COTS DRAM Memory Cubes to Space
Agnesina, Anthony, Yamaguchi, James, Krutzik, Christian, Carson, John, Yang-Scharlotta, Jean, Lim, Sung Kyu
Published in 2019 IEEE Aerospace Conference (01.03.2019)
Published in 2019 IEEE Aerospace Conference (01.03.2019)
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Conference Proceeding
TSV-based PUF circuit for 3DIC sensor nodes in IoT applications
Chao Wang, Jun Zhou, Guruprasad, Katti, Xin Liu, Weerasekera, Roshan, Kim, Tony T.
Published in 2015 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) (01.06.2015)
Published in 2015 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) (01.06.2015)
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Conference Proceeding