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Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect

by Mahajan, Ravi, Sankman, Robert, Patel, Neha, Dae-Woo Kim, Aygun, Kemal, Zhiguo Qian, Mekonnen, Yidnekachew, Salama, Islam, Sharan, Sujit, Iyengar, Deepti, Mallik, Debendra
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)

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InFO (Wafer Level Integrated Fan-Out) Technology

by Chien-Fu Tseng, Chung-Shi Liu, Chi-Hsi Wu, Yu, Douglas
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)

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An Overview of the Development of a GPU with Integrated HBM on Silicon Interposer

by Chang-Chi Lee, Hung, C. P., Calvin Cheung, Ping-Feng Yang, Chin-Li Kao, Dao-Long Chen, Meng-Kai Shih, Chien-Lin Chang Chien, Yu-Hsiang Hsiao, Li-Chieh Chen, Su, Michael, Alfano, Michael, Siegel, Joe, Din, Julius, Black, Bryan
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)

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Development of High Density Fan Out Wafer Level Package (HD FOWLP) with Multi-layer Fine Pitch RDL for Mobile Applications

by Rao, Vempati Srinivasa, Chong, Chai Tai, Ho, David, Zhi, Ding Mian, Choong, Chong Ser, Sharon, Lim P.S., Ismael, Daniel, Liang, Ye Yong
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)

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Effect of Temperature on the High Strain Rate Properties of SAC Leadfree Alloys at Temperatures up to 200°C

by Lall, Pradeep, Di Zhang, Yadav, Vikas, Suhling, Jeff, Locker, David
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)

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Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors

by Lhostis, S., Farcy, A., Deloffre, E., Lorut, F., Mermoz, S., Henrion, Y., Berthier, L., Bailly, F., Scevola, D., Guyader, F., Gigon, F., Besset, C., Pellissier, S., Gay, L., Hotellier, N., Le Berrigo, A.-L, Moreau, S., Balan, V., Fournel, F., Jouve, A., Cheramy, S., Arnoux, M., Rebhan, B., Maier, G. A., Chitu, L.
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)

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Study on Process Induced Wafer Level Warpage of Fan-Out Wafer Level Packaging

by Che, F. X., Ho, David, Mian Zhi Ding, MinWoo, Daniel Rhee
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)

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Cyclic Stress-Strain Behavior of SAC305 Lead Free Solder: Effects of Aging, Temperature, Strain Rate, and Plastic Strain Range

by Nianjun Fu, Suhling, Jeffrey C., Lall, Pradeep
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)

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Wafer Warpage Experiments and Simulation for Fan-Out Chip on Substrate

by Yuan-Ting Lin, Wei-Hong Lai, Chin-Li Kao, Jian-Wen Lou, Ping-Feng Yang, Chi-Yu Wang, Chueh-An Hseih
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)

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Ultra-Fine Pitch 3D Integration Using Face-to-Face Hybrid Wafer Bonding Combined with a Via-Middle Through-Silicon-Via Process

by Soon-Wook Kim, Detalle, Mikael, Lan Peng, Nolmans, Philip, Heylen, Nancy, Velenis, Dimitrios, Miller, Andy, Beyer, Gerald, Beyne, Eric
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)

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3D SiP with Organic Interposer for ASIC and Memory Integration

by Li Li, Chia, Pierre, Ton, Paul, Nagar, Mohan, Patil, Sada, Jie Xue, Delacruz, Javier, Voicu, Marius, Hellings, Jack, Isaacson, Bill, Coor, Mark, Havens, Ross
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)

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A Wearable Flexible Hybrid Electronics ECG Monitor

by Poliks, Mark, Turner, James, Ghose, Kanad, Zhanpeng Jin, Garg, Mohit, Qiong Gui, Arias, Ana, Kahn, Yasser, Schadt, Mark, Egitto, Frank
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)

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Design of High Efficiency Integrated Voltage Regulators with Embedded Magnetic Core Inductors

by Mueller, S., Ahmed, K. Z., Singh, A., Davis, A. K., Mukhopadyay, S., Swaminathan, M., Mano, Y., Wang, Y., Wong, J., Bharathi, S., Moghadam, H. Fathi, Draper, D.
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)

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Breakthrough Packaging Level Shielding Techniques and EMI Effectiveness Modeling and Characterization

by Hoang, Jimmy-Dinh V., Darveaux, Robert, Lobianco, Tony, Yi Liu, Nguyen, Wayne
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)

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Miniaturized Double Side Cooling Packaging for High Power 3 Phase SiC Inverter Module with Junction Temperature over 220°C

by Woo, Daniel Rhee Min, Hwang How Yuan, Li, Jerry Aw Jie, Lee Jong Bum, Zhang Hengyun
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)

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Combination of Experimental and Simulation Methods for Analysis of Sintered Ag Joints for High Temperature Applications

by Weber, Constanze, Walter, Hans, Van Dijk, Marius, Hutter, Matthias, Wittler, Olaf, Lang, Klaus-Dieter
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)

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A Novel System in Package with Fan-Out WLP for High Speed SERDES Application

by Nan-Cheng Chen, Tung-Hsien Hsieh, Jinn, Jimmy, Po-Hao Chang, Huang, Fandy, Xiao, J. W., Chou, Alan, Lin, Benson
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)

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High Quality Fine-Pitch Cu-Cu Wafer-on-Wafer Bonding with Optimized Ti Passivation at 160°C

by Panigrahi, Asisa Kumar, Bonam, Satish, Ghosh, Tamal, Vanjari, Siva Rama Krishna, Singh, Shiv Govind
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)

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Process Capability and Elastomer Stamp Lifetime in Micro Transfer Printing

by Gomez, David, Ghosal, Kanchan, Meitl, Matthew A., Bonafede, Salvatore, Prevatte, Carl, Moore, Tanya, Raymond, Brook, Kneeburg, David, Fecioru, Alin, Trindade, Antonio Jose, Bower, Christopher A.
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)

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Analysis and Comparison of Thermal Performance of Advanced Packaging Technologies for State-of-the-Art Mobile Applications

by Cheng-Chieh Hsieh, Chi-Hsi Wu, Yu, Douglas
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)

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