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Novel approach to fabricating carbon nanotube via interconnects using size-controlled catalyst nanoparticles
Sato, S., Nihei, M., Mimura, A., Kawabata, A., Kondo, D., Shioya, H., Iwai, T., Mishima, M., Ohfuti, M., Awano, Y.
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
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Conference Proceeding
On-Chip Copper-Based vs. Optical Interconnects: Delay Uncertainty, Latency, Power, and Bandwidth Density Comparative Predictions
Guoqing Chen, Hui Chen, Haurylau, M., Nelson, N.A., Albonesi, D.H., Fauchet, P.M., Friedman, E.G.
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
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Conference Proceeding
Cu Alloy Metallization for Self-Forming Barrier Process
Koike, J., Haneda, M., Iijima, J., Wada, M.
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
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Conference Proceeding
UV/EB Cure Mechanism for Porous PECVD/SOD Low-k SiCOH Materials
Nakao, S.-I., Ushio, J., Ohno, T., Hamada, T., Kamigaki, Y., Kato, M., Yoneda, K., Kondo, S., Kobayashi, N.
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
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Conference Proceeding
Direct CMP on Porous Low-k Film for Damage-less Cu Integration
Kondo, S., Fukaya, K., Ohashi, N., Miyazaki, T., Nagano, H., Wada, Y., Ishibashi, T., Kato, M., Yoneda, K., Soda, E., Nakao, S., Ishigami, K., Kobayashi, N.
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
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Conference Proceeding
BEOL Integration of Highly Damage -Resistant Porous Ultra Low-K Material Using Direct CMP and Via-first Process
Iijima, T., Lin, Q., Chen, S., Labelle, C., Fuller, N., Ponoth, S., Cohen, S., Lloyd, J., Dunn, D., Muzzy, C., Gill, J., Nitta, S., McGahay, V., Tyberg, C., Spooner, T., Nye, H.
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
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Conference Proceeding
Water and Copper Contamination in SiOC:H Damascene: Novel Characterization Methodology based on Triangular Voltage Sweep Measurements
Ciofi, I., Tokei, Z., Visalli, D., Van Hove, M.
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
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Conference Proceeding
Physical, Electrical, and Reliability Characterization of Ru for Cu Interconnects
Yang, C.-C., Spooner, T., Ponoth, S., Chanda, K., Simon, A., Lavoie, C., Lane, M., Hu, C.-K., Liniger, E., Gignac, L., Shaw, T., Cohen, S., McFeely, F., Edelstein, D.
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
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Conference Proceeding
Performance Comparison of Interconnect Technology and Architecture Options for Deep Submicron Technology Nodes
Bamal, M., List, S., Stucchi, M., Verhulst, A.S., Van Hove, M., Cartuyvels, R., Beyer, G., Maex, K.
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
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Conference Proceeding
Robust 45-nm Node Cu/LJLK Interconnects using Effective Porogen Control
Kagawa, Y., Enomoto, Y., Shimayama, T., Kameshima, T., Okamoto, M., Kawshima, H., Yamada, A., Hasegawa, T., Akiyama, K., Masuda, H., Miyajima, M., Shibata, H., Kadomura, S.
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
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Conference Proceeding
The rise of the 3rd dimension for system intergration
Beyne, E.
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
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Conference Proceeding
Breakthrough Integration of 32nm-node CulCntra Low-k SiOC (k=2.0) Interconnects by using Advanced Pore-Sealing and Low-k Hard Mask Technologies
Arakawa, S., Mizuno, I., Ohoka, Y., Nagahata, K., Tabuchi, K., Kanamura, R., Kadomura, S.
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
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Conference Proceeding
Reliability Improvement by Adopting Ti-barrier Metal B for Porous Low-k IL Structure
Sakata, A., Yamada, M., Hasunuma, M., Takahashi, S., Yamada, A., Hasegawa, T., Kaneko, H., Yamashita, S., Omoto, S., Hatano, M., Wada, J., Higashi, K., Yamaguchi, H., Yosho, T., Imamizu, K.
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
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Conference Proceeding
Highly Reliable Interface of Self-aligned CuSiN process with Low-k Sic barrier dielectric (k3.5) for 65nm node and beyond
Usami, T., Ide, T., Kakuhara, Y., Ajima, Y., Ueno, K., Maruyama, T., Yu, Y., Apen, E., Chattopadhyay, K., van Schravendijk, B., Oda, N., Sekine, M.
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
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Conference Proceeding
Wide Band Frequency Characterization of High Permittivity Dielectrics (High-K) for RF MIM Capacitors Integrated in BEOL
Lacrevaz, T., Flechet, B., Farcy, A., Torres, J., Vo, T.T., Bermond, C., Cueto, O., Defay, E., Gros-Jean, M., Blampey, B., Angenieux, G., Piquet, J., de Crecy, F.
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
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Conference Proceeding
Effect of CH4 plasma on porous dielectric modification & pore sealing for advanced interconnect technology nodes
Aimadeddine, M., Arnal, V., Roy, R., Farcy, A., David, T., Chevolleau, T., Posseme, N., Vitiello, J., Chapelon, L.L., Guedj, C., Brechet, Y., Volpi, F., Torres, J.
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
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Conference Proceeding
65nm Cu Integration and Interconnect Reliability in Low Stress K=2.75 SiCOH
McGahay, V., Bonilla, G., Chen, F., Christiansen, C., Cohen, S., Cullinan-Scholl, M., Demarest, J., Dunn, D., Engel, B., Fitzsimmons, J., Gill, J., Grunow, S., Herbst, B., Hichri, H., Ida, K., Klymko, N., Kiene, M., Labelle, C., Lee, T., Liniger, E., Liu, X.H., Madan, A., Malone, K., Martin, J., McLaughlin, P.V., Minami, P., Molis, S., Muzzy, C., Nguyen, S., Patel, J.C., Restaino, D., Sakamoto, A., Shaw, T.M., Shimooka, Y., Shobha, H., Simonyi, E., Widodo, J., Grill, A., Hannon, R., Lane, M., Nye, H., Spooner, T., Wisnieff, R., Ivers, T.
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
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Conference Proceeding
Self Aligned Barrier Approach: Overview on Process, Module Integration and Interconnect Performance Improvement Challenges
Gosset, L.G., Chhun, S., Guillan, J., Gras, R., Flake, J., Daamen, R., Michelon, J., Haumesser, P.-H., Olivier, S., Decorps, T., Torres, J.
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
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Conference Proceeding
UV Curing Effects on Glass Structure and Mechanical Properties of Organosilicate Low-k Thin Films
Gage, D.M., Guyer, E.P., Stebbins, J.F., Zhenjiang Cui, Amir Al-Bayati, Demos, A., MacWilliams, K.P., Dauskardt, R.H.
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
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Conference Proceeding
Manufacturable Low Keff (Keff<2.5) Cu Interconnects by Selective / Low Damage Air Gap Formation
Harada, T., Takahashi, M., Murakami, K., Korogi, H., Sasaki, T., Hattori, T., Ogawa, S., Ueda, T.
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
Published in Proceedings of the IEEE International Interconnect Technology Conference (2006)
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Conference Proceeding