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Laser slicing of a diamond at the {100} plane using an irradiation sequence that restricts crack propagation along the {111} plane
Sakamoto, Kosuke, Tokunaga, Daijiro, Itoh, Sho, Hidai, Hirofumi, Matsusaka, Souta, Omatsu, Takashige, Koyama, Koji, Kim, Seong-Woo, Morita, Noboru
Published in Diamond and related materials (01.06.2023)
Published in Diamond and related materials (01.06.2023)
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Journal Article
Curved hole drilling by laser manipulation of a heat spot inside glass
Miyakoda, Kaito, Sunayama, Koki, Sakamoto, Kosuke, Tokunaga, Daijiro, Hidai, Hirofumi, Matsusaka, Souta
Published in Precision engineering (01.05.2023)
Published in Precision engineering (01.05.2023)
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Journal Article
Focus movement distance per pulse dependence of electrical conductivity and diameter of diamond internal modification induced by picosecond laser
Tokunaga, Daijiro, Sato, Masataka, Itoh, Sho, Hidai, Hirofumi, Omatsu, Takashige, Matsusaka, Souta
Published in Scientific reports (31.10.2022)
Published in Scientific reports (31.10.2022)
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Journal Article
Observation of crack propagation and stress distribution in diamond induced by ultrashort-pulsed laser illumination
Tokunaga, D., Sakamoto, K., Itoh, S., Omatsu, T., Hidai, H., Matsusaka, S.
Year of Publication 17.03.2023
Year of Publication 17.03.2023
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Conference Proceeding
Branched hole drilling in silica glass by continuous-wave laser backside irradiation
Shun, Sato, Tokunaga, Daijiro, Hidai, Hirofumi, Matsusaka, Souta, Chiba, Akira, Morita, Noboru
Published in Precision Engineering (01.11.2019)
Published in Precision Engineering (01.11.2019)
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Journal Article