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Substrate Embedded Power Electronics Packaging for Silicon Carbide mosfets
Janabi, Ameer, Shillaber, Luke, Ying, Wucheng, Mu, Wei, Hu, Borong, Jiang, Yunlei, Iosifidis, Nikolaos, Ran, Li, Long, Teng
Published in IEEE transactions on power electronics (01.08.2024)
Published in IEEE transactions on power electronics (01.08.2024)
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Journal Article
Multi-material Design in the Case of a Coupled Selection of Architectures and Materials: Application to Embedded Electronic Packaging
Baracchini, Paul, Guillebaud, Claire, Kromm, François-Xavier, Wargnier, Hervé
Published in Journal of materials engineering and performance (01.12.2019)
Published in Journal of materials engineering and performance (01.12.2019)
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Journal Article
Additive electronics manufacturing of embedded RF die packaging and multi-chip phased array module
Obeidat, Abdullah S., Umar, Ashraf, Al-Haidari, Riadh, Alshaibani, W.T., Dou, Zhi, Alshatnawi, Firas, Gonya, Stephen, Poliks, Mark D., Hoel, Cathleen, Boyd, Linda, Bellows, Charles, Soto-Valle, Genaro, Iannotti, Joe, Budka, Thomas, Duffel, Kevin, Case, Jason, Pavinatto, Felippe
Published in Journal of manufacturing processes (30.08.2025)
Published in Journal of manufacturing processes (30.08.2025)
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Journal Article
Embedded electronic packaging and associated methods
Year of Publication 13.02.2018
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Patent
Embedded electronic packaging and associated methods
Year of Publication 13.09.2016
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Patent
Harris Assigned Patent for Embedded Electronic Packaging
Published in Targeted News Service
(14.02.2018)
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Newsletter
Front-end electronics for PWO-based PHOS calorimeter of ALICE
Muller, Hans, Budnikov, Dmitry, Ippolitov, Mikhail, Li, Qingxia, Manko, Vladislav, Pimenta, Rui, Rohrich, Dieter, Sibiryak, Iouri, Skaali, Bernhard, Vinogradov, Alexandre
Published in Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment (01.11.2006)
Published in Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment (01.11.2006)
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Journal Article
EMBEDDED ELECTRONIC PACKAGING AND ASSOCIATED METHODS
Year of Publication 11.08.2016
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Patent
EMBEDDED ELECTRONIC PACKAGING AND ASSOCIATED METHODS
Year of Publication 11.09.2013
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Patent
US Patent Issued to HongQiSheng Precision Electronics (QinHuangDao), Avary Holding (Shenzhen) Co. Ltd. on Jan. 2 for "Packaging structure with embedded electronic components and method for manufacturing the same" (Taiwanese, Chinese Inventors)
Published in US Fed News Service, Including US State News
(03.01.2024)
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Newsletter
Patent Issued for Embedded Electronic Packaging and Associated Methods
Published in Electronics Newsweekly
(27.09.2016)
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Newsletter