SiC power module design performance, robustness and reliability

Wide Bandgap semiconductor devices offer higher efficiency, smaller size, less weight, and longer lifetime, with applications in power grid electronics and electromobility. This book describes the state of advanced packaging solutions for novel wide-band-gap semiconductors, specifically silicon carb...

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Bibliographic Details
Other Authors: Castellazzi, Alberto (Editor), Irace, Andrea (Editor)
Format: eBook
Language: English
Published: London, United Kingdom The Institution of Engineering and Technology 2021
Series: IET energy engineering series ; 151.
Subjects:
ISBN: 178561908X
9781785619083
9781785619076
1785619071
Physical Description: 1 online resource illustrations

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Summary: Wide Bandgap semiconductor devices offer higher efficiency, smaller size, less weight, and longer lifetime, with applications in power grid electronics and electromobility. This book describes the state of advanced packaging solutions for novel wide-band-gap semiconductors, specifically silicon carbide (SiC) MOSFETs and diodes
ISBN: 178561908X
9781785619083
9781785619076
1785619071
Access: Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty