SiC power module design performance, robustness and reliability

Wide Bandgap semiconductor devices offer higher efficiency, smaller size, less weight, and longer lifetime, with applications in power grid electronics and electromobility. This book describes the state of advanced packaging solutions for novel wide-band-gap semiconductors, specifically silicon carb...

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Bibliographic Details
Other Authors Castellazzi, Alberto (Editor), Irace, Andrea (Editor)
Format Electronic eBook
LanguageEnglish
Published London, United Kingdom The Institution of Engineering and Technology 2021
SeriesIET energy engineering series ; 151.
Subjects
Wide gap semiconductors.
Silicon carbide.
elektronické knihy
electronic books
Online AccessFull text
ISBN178561908X
9781785619083
9781785619076
1785619071
Physical Description1 online resource illustrations

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Summary:Wide Bandgap semiconductor devices offer higher efficiency, smaller size, less weight, and longer lifetime, with applications in power grid electronics and electromobility. This book describes the state of advanced packaging solutions for novel wide-band-gap semiconductors, specifically silicon carbide (SiC) MOSFETs and diodes
ISBN:178561908X
9781785619083
9781785619076
1785619071
Access:Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty
Physical Description:1 online resource illustrations

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