SiC power module design performance, robustness and reliability
Wide Bandgap semiconductor devices offer higher efficiency, smaller size, less weight, and longer lifetime, with applications in power grid electronics and electromobility. This book describes the state of advanced packaging solutions for novel wide-band-gap semiconductors, specifically silicon carb...
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Other Authors: | , |
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Format: | eBook |
Language: | English |
Published: |
London, United Kingdom
The Institution of Engineering and Technology
2021
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Series: | IET energy engineering series ;
151. |
Subjects: | |
ISBN: | 178561908X 9781785619083 9781785619076 1785619071 |
Physical Description: | 1 online resource illustrations |
Summary: | Wide Bandgap semiconductor devices offer higher efficiency, smaller size, less weight, and longer lifetime, with applications in power grid electronics and electromobility. This book describes the state of advanced packaging solutions for novel wide-band-gap semiconductors, specifically silicon carbide (SiC) MOSFETs and diodes |
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ISBN: | 178561908X 9781785619083 9781785619076 1785619071 |
Access: | Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty |