RF and Microwave Module Level Design and Integration

This book is intended to bring together fundamental concepts and elements needed in the design, integration, and characterization phases of modern radio frequency (RF) and microwave modules and to familiarize the interested reader with the common challenges in this rapidly changing field. While desi...

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Bibliographic Details
Main Author: Almalkawi, Mohammad, (Author)
Format: eBook
Language: English
Published: London : The Institution of Engineering and Technology, 2019.
Series: Materials, circuits and devices series ; 34.
Subjects:
Computer-aided design.
Electric circuits.
Electric networks, Passive.
Electronic circuit design.
Electronic packaging.
Impedance matching.
Lumped elements (Electronics)
Microwave circuits.
elektronické knihy
electronic books
ISBN: 178561360X
9781785613609
1785613596
9781785613593
Physical Description: 1 online resource (337 pages)

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Table of contents

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020 |a 178561360X 
020 |a 9781785613609  |q (electronic bk.) 
020 |z 1785613596 
020 |z 9781785613593 
035 |a (OCoLC)1112093460  |z (OCoLC)1135941621 
100 1 |a Almalkawi, Mohammad,  |e author. 
245 1 0 |a RF and Microwave Module Level Design and Integration /  |c Mohammad Almalkawi. 
264 1 |a London :  |b The Institution of Engineering and Technology,  |c 2019. 
264 4 |c ©2019 
300 |a 1 online resource (337 pages) 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
490 1 |a IET Materials, Circuits and Devices series ;  |v 34 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty 
520 |a This book is intended to bring together fundamental concepts and elements needed in the design, integration, and characterization phases of modern radio frequency (RF) and microwave modules and to familiarize the interested reader with the common challenges in this rapidly changing field. While design for manufacturability (DFM) and design for testability (DFT) are two important practices that stress the need for careful attention at the early design stages of a product, module integration to achieve optimal RF performance is an art form that takes years to master. In this context, the objective of this book is to provide the necessary practical and theoretical background needed to tackle a multitude of issues accompanied by the design of contemporary RF modules. The topics covered can serve a broad range of individuals: those just entering the field, graduate-level students, and researchers, as well as practicing engineers seeking new domains to expand their knowledge, understand design tradeoffs, and looking for a quick guide in digesting the several aspects of the RF module design processes and their common challenges. The book comprises eight chapters which discuss: packaging, lumped and distributed passive elements, microwave network analysis, impedance matching networks, electromagnetic field couplings, CAD, components of RF front-end modules, component- and module-level measurements. 
590 |a Knovel  |b Knovel (All titles) 
650 0 |a Computer-aided design. 
650 0 |a Electric circuits. 
650 0 |a Electric networks, Passive. 
650 0 |a Electronic circuit design. 
650 0 |a Electronic packaging. 
650 0 |a Impedance matching. 
650 0 |a Lumped elements (Electronics) 
650 0 |a Microwave circuits. 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
776 0 8 |i Print version:  |z 9781785613609 
776 0 8 |i Print version:  |z 1785613596  |z 9781785613593  |w (OCoLC)1089417906 
830 0 |a Materials, circuits and devices series ;  |v 34. 
856 4 0 |u https://proxy.k.utb.cz/login?url=https://app.knovel.com/hotlink/toc/id:kpRFMMLDI1/rf-and-microwave?kpromoter=marc  |y Full text 

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