Harsh environment electronics : interconnect materials and performance assessment
Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barrie...
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| Other Authors | |
|---|---|
| Format | Electronic eBook |
| Language | English |
| Published |
Weinheim, Germany :
Wiley-VCH Verlag GmbH & Co.,
[2019]
|
| Subjects | |
| Online Access | Full text |
| ISBN | 9783527813995 3527813993 9783527813964 3527813969 9783527344192 3527344195 9783527813971 3527813977 |
| Physical Description | 1 online resource |
Cover
Table of Contents:
- Wide-Bandgap Semiconductor Device Technologies for High-Temperature and Harsh Environment Applications / Md Rafiqul Islam, Roisul H Galib, Montajar Sarkar, Shaestagir Chowdhury
- High-Temperature Lead-free Solder Materials and Applications / Mohd F M Sabri, Bakhtiar Ali, Suhana M Said
- Role of Alloying Addition in Zn-Based Pb-Free Solders / Khairul Islam, Ahmed Sharif
- Effect of Cooling Rate on the Microstructure, Mechanical Properties, and Creep Resistance of a Cast Zn-Al-Mg High-temperature Lead-Free Solder Alloy / Reza Mahmudi, Davood Farasheh, Seyyed S Biriaie
- Development of Zn-Al-x Ni Lead-Free Solders for High-Temperature Applications / Sanjoy Mallick, Md Sharear Kabir, Ahmed Sharif
- Study of Zn-Mg-Ag High-Temperature Solder Alloys / Roisul H Galib, Md Ashif Anwar, Ahmed Sharif
- Characterization of Zn-Mo and Zn-Cr Pb-Free Composite Solders as a Potential Replacement for Pb-Containing Solders / Khairul Islam, Ahmed Sharif
- Gold-Based Interconnect Systems for High-Temperature and Harsh Environments / Ayesha Akter, Ahmed Sharif, Rubayyat Mahbub
- Bi-Based Interconnect Systems and Applications / Manifa Noor, Ahmed Sharif
- Recent Advancement of Research in Silver-Based Solder Alloys / Ahmed Sharif
- Silver Nanoparticles as Interconnect Materials / Md Ashif Anwar, Roisul Hasan Galib, Ahmed Sharif
- Transient Liquid Phase Bonding / Tariq Islam, Ahmed Sharif
- All-Copper Interconnects for High-Temperature Applications / Ahmed Sharif
- Glass-Frit-Based Die-Attach Solution for Harsh Environments / Ahmed Sharif
- Carbon-Nanotube-Reinforced Solders as Thermal Interface Materials / Md Muktadir Billah
- Reliability Study of Solder Joints in Electronic Packaging Technology / Ahmed Sharif, Sushmita Majumder.