Micro-Nano-Integration ; 7th GMM-Workshop : 22-23 Oct. 2018.

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Bibliographic Details
Corporate Authors: GMM Workshop "Mikro-Nano-Integration" Dortmund, Germany), VDE/VDI-Gesellschaft Mikroelektronik, Mikrosystem- und Feinwerktechnik., Institute of Electrical and Electronics Engineers.
Format: eBook
Language: English
Published: Berlin, Germany : [VDE Verlag], [2018?]
Subjects:
Nanostructures > Congresses.
Microelectronics > Congresses.
elektronické knihy
electronic books
ISBN: 1523126728
9781523126729
9783800747894
3800747898
Physical Description: 1 online resource (various pagings) : illustrations

Cover

Table of contents

LEADER 03816cam a2200445 i 4500
001 kn-on1086516124
003 OCoLC
005 20240717213016.0
006 m o d
007 cr cn|||||||||
008 190215s2018 gw a ob 100 0 eng d
040 |a COO  |b eng  |e rda  |e pn  |c COO  |d MYG  |d OCLCF  |d UAB  |d OCLCQ  |d OCLCO  |d HNC 
020 |a 1523126728  |q (ebook) 
020 |a 9781523126729  |q (ebook) 
020 |z 9783800747894 
020 |z 3800747898 
035 |a (OCoLC)1086516124 
111 2 |a GMM Workshop "Mikro-Nano-Integration"  |n (7th :  |d 2018 :  |c Dortmund, Germany) 
245 1 0 |a Micro-Nano-Integration ; 7th GMM-Workshop :  |b 22-23 Oct. 2018. 
246 3 |a 7th GMM-Workshop Micro-Nano-Integration 
246 1 |i Also known as:  |a Mikro-Nano-Integration 2018 
264 1 |a Berlin, Germany :  |b [VDE Verlag],  |c [2018?] 
300 |a 1 online resource (various pagings) :  |b illustrations 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
500 |a Conference venue information taken from conference website. 
500 |a Conference location: Dortmund, Germany. 
504 |a Includes bibliographical references. 
505 0 0 |g Posterblock 1.  |t 01. Penetrating Nanoelectrodes for an Electrical Cell Interface on CMOS ASIC --  |t 02. Fluorescent E-beam and Photolithographic Resists for Upconversion --  |t 03. Adding CNT-based Functionality to MEMS: A Technology Demonstration for Strain and IR Sensors on Wafer Scale --  |t 04. Rapid Micro-Nano-Integration of Single Silicon Nanowiresin 2D-Sensors Arrays using Automated Software Tools --  |t 05. New Concept for Post-CMOS Pellistor Integration --  |t 06. Analysis and Similation of Super-Hydrophobic Layers of Microfluidic Applications --  |t 07 Electrochemical Deposition of Reactive Material Systems for Assembly and Packaging Applications --  |t 08. Combining Nanoimprint Lithography, Electroplating and Microstructuring Techniques to Fabricate 3D Nanostructured Multielectrode Arrays for Biological Applications  |g Posterblock 2.  |t 09. Low Power Miniaturized Tunnel Magnetoresistive (TMR) Sensors for Industry 4.0 Applications --  |t 10. Mesoscopic Optics --  |t 11. Combining Top-down Bottom-up Lithographic and Galvanic Manufacturing Techniques for the Generation of Dynamic and Reversible Surfaces --  |t 12. Y2O3 Sol-Gel Passivation Layer for Solution-Processed Metal-Oxide Thin Film Transistors --  |t 13. Thin Film ALD Materials as Functional Layer for 3D-Integrated Metal Oxide Gas-Sensors --  |t 14. Fabrication of Polymeric Micro-Optical Components with Integrated Nano-Topography for Advanced Photonic Applications --  |t 15. Performance Analysis of CuO Nanoparticle-Based Thin-Film Transistors --  |t 16. Effective Conversion Processes of Metal-Oxide Precursors for the Reduction of the Conversion Temperature in Solution Processed Metal-Oxide Thin-Film Transistors --  |t 17. Influence of the Electrode Material on the Performance of BTBT-Based Thin-Film Transistors --  |t 18. Applications of Ion-Track Etched Polymer Membranes in Micro-Nano-Integration. 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty 
590 |a Knovel  |b Knovel (All titles) 
650 0 |a Nanostructures  |v Congresses. 
650 0 |a Microelectronics  |v Congresses. 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
710 2 |a Verband der Elektrotechnik, Elektronik, Informationstechnik,  |e issuing body. 
710 2 |a VDE/VDI-Gesellschaft Mikroelektronik, Mikrosystem- und Feinwerktechnik. 
710 2 |a Institute of Electrical and Electronics Engineers. 
856 4 0 |u https://proxy.k.utb.cz/login?url=https://app.knovel.com/hotlink/toc/id:kpGMMFMNI2/gmm-fachbericht-92?kpromoter=marc  |y Full text 

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