Micro-Nano-Integration ; 7th GMM-Workshop : 22-23 Oct. 2018.
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| Corporate Authors | , , |
|---|---|
| Format | Electronic eBook |
| Language | English |
| Published |
Berlin, Germany :
[VDE Verlag],
[2018?]
|
| Subjects | |
| Online Access | Full text |
| ISBN | 1523126728 9781523126729 9783800747894 3800747898 |
| Physical Description | 1 online resource (various pagings) : illustrations |
Cover
| LEADER | 00000cam a2200000 i 4500 | ||
|---|---|---|---|
| 001 | kn-on1086516124 | ||
| 003 | OCoLC | ||
| 005 | 20240717213016.0 | ||
| 006 | m o d | ||
| 007 | cr cn||||||||| | ||
| 008 | 190215s2018 gw a ob 100 0 eng d | ||
| 040 | |a COO |b eng |e rda |e pn |c COO |d MYG |d OCLCF |d UAB |d OCLCQ |d OCLCO |d HNC | ||
| 020 | |a 1523126728 |q (ebook) | ||
| 020 | |a 9781523126729 |q (ebook) | ||
| 020 | |z 9783800747894 | ||
| 020 | |z 3800747898 | ||
| 035 | |a (OCoLC)1086516124 | ||
| 111 | 2 | |a GMM Workshop "Mikro-Nano-Integration" |n (7th : |d 2018 : |c Dortmund, Germany) | |
| 245 | 1 | 0 | |a Micro-Nano-Integration ; 7th GMM-Workshop : |b 22-23 Oct. 2018. |
| 246 | 3 | |a 7th GMM-Workshop Micro-Nano-Integration | |
| 246 | 1 | |i Also known as: |a Mikro-Nano-Integration 2018 | |
| 264 | 1 | |a Berlin, Germany : |b [VDE Verlag], |c [2018?] | |
| 300 | |a 1 online resource (various pagings) : |b illustrations | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 500 | |a Conference venue information taken from conference website. | ||
| 500 | |a Conference location: Dortmund, Germany. | ||
| 504 | |a Includes bibliographical references. | ||
| 505 | 0 | 0 | |g Posterblock 1. |t 01. Penetrating Nanoelectrodes for an Electrical Cell Interface on CMOS ASIC -- |t 02. Fluorescent E-beam and Photolithographic Resists for Upconversion -- |t 03. Adding CNT-based Functionality to MEMS: A Technology Demonstration for Strain and IR Sensors on Wafer Scale -- |t 04. Rapid Micro-Nano-Integration of Single Silicon Nanowiresin 2D-Sensors Arrays using Automated Software Tools -- |t 05. New Concept for Post-CMOS Pellistor Integration -- |t 06. Analysis and Similation of Super-Hydrophobic Layers of Microfluidic Applications -- |t 07 Electrochemical Deposition of Reactive Material Systems for Assembly and Packaging Applications -- |t 08. Combining Nanoimprint Lithography, Electroplating and Microstructuring Techniques to Fabricate 3D Nanostructured Multielectrode Arrays for Biological Applications |g Posterblock 2. |t 09. Low Power Miniaturized Tunnel Magnetoresistive (TMR) Sensors for Industry 4.0 Applications -- |t 10. Mesoscopic Optics -- |t 11. Combining Top-down Bottom-up Lithographic and Galvanic Manufacturing Techniques for the Generation of Dynamic and Reversible Surfaces -- |t 12. Y2O3 Sol-Gel Passivation Layer for Solution-Processed Metal-Oxide Thin Film Transistors -- |t 13. Thin Film ALD Materials as Functional Layer for 3D-Integrated Metal Oxide Gas-Sensors -- |t 14. Fabrication of Polymeric Micro-Optical Components with Integrated Nano-Topography for Advanced Photonic Applications -- |t 15. Performance Analysis of CuO Nanoparticle-Based Thin-Film Transistors -- |t 16. Effective Conversion Processes of Metal-Oxide Precursors for the Reduction of the Conversion Temperature in Solution Processed Metal-Oxide Thin-Film Transistors -- |t 17. Influence of the Electrode Material on the Performance of BTBT-Based Thin-Film Transistors -- |t 18. Applications of Ion-Track Etched Polymer Membranes in Micro-Nano-Integration. |
| 506 | |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty | ||
| 590 | |a Knovel |b Knovel (All titles) | ||
| 650 | 0 | |a Nanostructures |v Congresses. | |
| 650 | 0 | |a Microelectronics |v Congresses. | |
| 655 | 7 | |a elektronické knihy |7 fd186907 |2 czenas | |
| 655 | 9 | |a electronic books |2 eczenas | |
| 710 | 2 | |a Verband der Elektrotechnik, Elektronik, Informationstechnik, |e issuing body. | |
| 710 | 2 | |a VDE/VDI-Gesellschaft Mikroelektronik, Mikrosystem- und Feinwerktechnik. | |
| 710 | 2 | |a Institute of Electrical and Electronics Engineers. | |
| 856 | 4 | 0 | |u https://proxy.k.utb.cz/login?url=https://app.knovel.com/hotlink/toc/id:kpGMMFMNI2/gmm-fachbericht-92?kpromoter=marc |y Full text |