Encapsulation technologies for electronic applications

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D...

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Bibliographic Details
Main Authors: Ardebili, Haleh, (Author), Zhang, Jiawei, (Author), Pecht, Michael, (Author)
Format: eBook
Language: English
Published: Oxford, United Kingdom : William Andrew, [2019]
Edition: Second edition.
Series: Materials and processes for electronic applications series.
Subjects:
Electronic apparatus and appliances > Plastic embedment.
elektronické knihy
electronic books
ISBN: 9780128119792
0128119799
9780128119785
0128119780
Physical Description: 1 online resource : illustrations

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Table of contents

LEADER 03392cam a2200421 i 4500
001 kn-on1057341368
003 OCoLC
005 20240717213016.0
006 m o d
007 cr cn|||||||||
008 181018s2019 enka ob 001 0 eng d
040 |a N$T  |b eng  |e rda  |e pn  |c N$T  |d N$T  |d OPELS  |d OCLCF  |d YDX  |d OCLCQ  |d MERER  |d D6H  |d OCLCQ  |d S2H  |d OCLCO  |d OCLCQ  |d OCLCO  |d K6U  |d OCLCQ  |d SFB  |d OCLCQ  |d OCLCO  |d OCLCL  |d SXB 
020 |a 9780128119792  |q (electronic bk.) 
020 |a 0128119799  |q (electronic bk.) 
020 |z 9780128119785 
020 |z 0128119780 
035 |a (OCoLC)1057341368  |z (OCoLC)1057375817  |z (OCoLC)1079906388 
100 1 |a Ardebili, Haleh,  |e author. 
245 1 0 |a Encapsulation technologies for electronic applications /  |c Haleh Ardebili, Jiawei Zhang, Michael G. Pecht. 
250 |a Second edition. 
264 1 |a Oxford, United Kingdom :  |b William Andrew,  |c [2019] 
300 |a 1 online resource :  |b illustrations 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
490 1 |a Materials and processes for electronic applications series 
504 |a Includes bibliographical references and index. 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty 
520 |a Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. 
590 |a Knovel  |b Knovel (All titles) 
650 0 |a Electronic apparatus and appliances  |x Plastic embedment. 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
700 1 |a Zhang, Jiawei,  |e author. 
700 1 |a Pecht, Michael,  |e author. 
776 0 8 |i Print version:  |a Ardebili, Haleh.  |t Encapsulation technologies for electronic applications.  |b Second edition.  |d Oxford, United Kingdom : William Andrew, [2019]  |z 0128119780  |z 9780128119785  |w (OCoLC)1007042873 
830 0 |a Materials and processes for electronic applications series. 
856 4 0 |u https://proxy.k.utb.cz/login?url=https://app.knovel.com/hotlink/toc/id:kpETEAE003/encapsulation-technologies-for?kpromoter=marc  |y Full text 

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