ISTFA 2017 : conference proceedings from the 43rd International Symposium for Testing and Failure Analysis : November 5-9, 2017, Pasadena Convention Center, Pasadena, California, USA

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Bibliographic Details
Corporate Authors International Symposium for Testing and Failure Analysis Fort Worth, Tex., ASM International, Electronic Device Failure Analysis Society
Format Electronic eBook
LanguageEnglish
Published Materials Park, Ohio : ASM International, ©2017.
Subjects
Electronics > Materials > Testing > Congresses.
Electronic apparatus and appliances > Testing > Congresses.
elektronické knihy
electronic books
Online AccessFull text
ISBN9781627081511
1627081518
162708150X
9781627081504
Physical Description1 online resource (665 pages)

Cover

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035 |a (OCoLC)1054065511  |z (OCoLC)1051682432 
111 2 |a International Symposium for Testing and Failure Analysis  |n (42nd :  |d 2016 :  |c Fort Worth, Tex.) 
245 1 0 |a ISTFA 2017 :  |b conference proceedings from the 43rd International Symposium for Testing and Failure Analysis : November 5-9, 2017, Pasadena Convention Center, Pasadena, California, USA /  |c organized by EDFAS, ISTFA/2017, ASM International. 
260 |a Materials Park, Ohio :  |b ASM International,  |c ©2017. 
300 |a 1 online resource (665 pages) 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
504 |a Includes bibliographical references and index. 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty 
590 |a Knovel  |b Knovel (All titles) 
650 0 |a Electronics  |x Materials  |x Testing  |v Congresses. 
650 0 |a Electronic apparatus and appliances  |x Testing  |v Congresses. 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
710 2 |a ASM International. 
710 2 |a Electronic Device Failure Analysis Society. 
776 0 8 |i Print version:  |a International, A S M.  |t ISTFA(tm) 2017 Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis.  |d Materials Park : A S M International, ©2017  |z 9781627081504 
856 4 0 |u https://proxy.k.utb.cz/login?url=https://app.knovel.com/hotlink/toc/id:kpISTFAC6X/istfa-2017-conference?kpromoter=marc  |y Full text 

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