ISTFA 2017 : conference proceedings from the 43rd International Symposium for Testing and Failure Analysis : November 5-9, 2017, Pasadena Convention Center, Pasadena, California, USA

• Corporate Authors: International Symposium for Testing and Failure Analysis Fort Worth, Tex.), ASM International., Electronic Device Failure Analysis Society.
• Format: eBook
• Language: English
• Published: Materials Park, Ohio : ASM International, ©2017.
• Subjects: Electronics > Materials > Testing > Congresses.; Electronic apparatus and appliances > Testing > Congresses.; elektronické knihy; electronic books
• ISBN: 9781627081511; 1627081518; 162708150X; 9781627081504
• Physical Description: 1 online resource (665 pages)
• Access: Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty