The Circuit Designer's Companion.

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Bibliographic Details
Main Author: Wilson, Peter.
Format: eBook
Language: English
Published: Saint Louis : Elsevier Science, 2017.
Edition: 4th ed.
Subjects:
Electronic circuit design.
elektronické knihy
electronic books
ISBN: 9780081017654
0081017650
9780081017647
0081017642
Physical Description: 1 online resource (498 pages)

Cover

Table of contents

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100 1 |a Wilson, Peter. 
245 1 4 |a The Circuit Designer's Companion. 
250 |a 4th ed. 
264 1 |a Saint Louis :  |b Elsevier Science,  |c 2017. 
300 |a 1 online resource (498 pages) 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
505 0 |a Front Cover; The Circuit Designer's Companion; The Circuit Designer's Companion; Copyright; Contents; Introduction; INTRODUCTION TO THE FOURTH EDITION; INTRODUCTION TO THE THIRD EDITION; INTRODUCTION TO THE SECOND EDITION (TIM WILLIAMS,2004); INTRODUCTION TO THE FIRST EDITION (TIM WILLIAMS, 1990); 1 -- Grounding and Wiring; 1.1 GROUNDING; When to Consider Grounding?; 1.1.1 GROUNDING WITHIN ONE UNIT; 1.1.2 CHASSIS GROUND; 1.1.3 THE CONDUCTIVITY OF ALUMINUM; 1.1.4 GROUND LOOPS; 1.1.5 POWER SUPPLY RETURNS; Varying Loads; Power Rail Feed; Conductor Impedance; 1.1.6 INPUT SIGNAL GROUND. 
505 8 |a Connection to 0V Elsewhere on the Printed Circuit BoardConnection to 0V Within the Unit; External Ground Connection; 1.1.7 OUTPUT SIGNAL GROUND; Avoiding the Common Impedance; 1.1.8 INTERBOARD INTERFACE SIGNALS; Partitioning the Signal Return; 1.1.9 STAR-POINT GROUNDING; 1.1.10 GROUND CONNECTIONS BETWEEN UNITS; Breaking the Ground Link; 1.1.11 SHIELDING; Which End to Ground for Low-Frequency Shielding?; Electrostatic Screening; Surface Transfer Impedance; 1.1.12 THE SAFETY EARTH; 1.2 WIRING AND CABLES; 1.2.1 WIRE TYPES; Wire Inductance; Equipment Wire; Wire-Wrap Wire; 1.2.2 CABLE TYPES. 
505 8 |a 1.2.3 POWER CABLES1.2.4 DATA AND MULTICORE CABLES; Data Communication Cables; Structured Data Cable; Shielding and Microphony; 1.2.5 RADIO FREQUENCY CABLES; 1.2.6 TWISTED PAIR; 1.2.7 CROSS TALK; Digital Cross Talk; 1.3 TRANSMISSION LINES; Transmission Line Effects; Critical Lengths for Pulses; 1.3.1 CHARACTERISTIC IMPEDANCE; 1.3.2 TIME DOMAIN; Forward and Reflected Waves; Ringing; The Bergeron Diagram; The Uses of Mismatching; 1.3.3 FREQUENCY DOMAIN; Standing Wave Distribution Versus Frequency; Impedance Transformation; Lossy Lines; Understanding the Transmission Line Impedance Graphically. 
505 8 |a 2 -- Printed Circuits2.1 BOARD TYPES; 2.1.1 MATERIALS; Epoxy Glass; 2.1.2 TYPE OF CONSTRUCTION; 2.1.3 CHOICE OF TYPE; 2.1.4 CHOICE OF SIZE; Subdivision Boundaries; Panelization; 2.1.5 HOW A MULTILAYER BOARD IS MADE; 2.2 DESIGN RULES; 2.2.1 TRACK WIDTH AND SPACING; Conductor Resistance; Voltage Breakdown and Cross Talk; Constant Impedance; 2.2.2 HOLE AND PAD SIZE; Vias; Through Hole Pads; Surface Mount Pads; 2.2.3 TRACK ROUTING; 2.2.4 GROUND AND POWER DISTRIBUTION; Ground Rail Inductance; Gridded Ground Layout; The Ground Plane; Inside or Outside Layers; Multiple Ground Planes. 
505 8 |a 2.2.5 COPPER PLATING AND FINISHING2.2.6 SOLDER RESIST; Screen-Printed Resists; Photo-Imaged Film; 2.2.7 TERMINATIONS AND CONNECTIONS; Two-Part Connectors; Edge Connectors; 2.3 BOARD ASSEMBLY: SURFACE MOUNT AND THROUGH HOLE; 2.3.1 SURFACE MOUNT DESIGN RULES; Solder Process; Printed Circuit Board Quality; Thermal Stresses; Cleaning and Testing; 2.3.2 PACKAGE PLACEMENT; 2.3.3 COMPONENT IDENTIFICATION; Polarity Indication; Guarding; 2.3.4 UNDERSTANDING THERMAL BEHAVIOR; Thermal Conduction; Thermal Convection; Thermal Radiation; Thermal Capacity; Thermal Expansion; Thermal Shock; Thermal Cycling. 
500 |a Solder Cracking. 
504 |a Includes bibliographical references and index. 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty 
590 |a Knovel  |b Knovel (All titles) 
650 0 |a Electronic circuit design. 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
776 0 8 |i Print version:  |a Wilson, Peter.  |t Circuit Designer's Companion.  |d Saint Louis : Elsevier Science, ©2017  |z 9780081017647 
856 4 0 |u https://proxy.k.utb.cz/login?url=https://app.knovel.com/hotlink/toc/id:kpCDCE0022/circuit-designers-companion?kpromoter=marc  |y Full text 

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