Advances in hygrothermal performance of building envelopes : materials, systems and simulations

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Bibliographic Details
Corporate Author ASTM International Committee C16 on Thermal Insulation. Subcommittee C16.33 on Insulation Finishes and Moisture (sponsoring body.)
Other Authors Mukhopadhyaya, P. 1968- (Editor), Fisler, Diana, 1964- (Editor)
Format Electronic eBook
LanguageEnglish
Published West Conshohocken, PA : ASTM International, [2017]
SeriesSelected technical papers ; STP1599
Subjects
Buildings > Airtightness > Congresses.
Exterior walls > Thermal properties > Congresses.
Dampness in buildings > Congresses.
Waterproofing > Congresses.
elektronické knihy
electronic books
Online AccessFull text
ISBN9780803176485
0803176481
9780803176478
Physical Description1 online resource.

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Item Description:"Contains peer-reviewed papers that were presented at a symposium held October 26-27, 2016, in Orlando, Florida, USA. The workshop was sponsored by ASTM International Committee C16 on Thermal Insulation and Subcommittee C16.33 on Insulation Finishes and Moisture."
Bibliography:Includes bibliographical references and index.
ISBN:9780803176485
0803176481
9780803176478
Access:Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty
Physical Description:1 online resource.

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