Advances in hygrothermal performance of building envelopes : materials, systems and simulations

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Bibliographic Details
Corporate Author: ASTM International Committee C16 on Thermal Insulation. Subcommittee C16.33 on Insulation Finishes and Moisture, (sponsoring body.)
Other Authors: Mukhopadhyaya, P. 1968- (Editor), Fisler, Diana, 1964- (Editor)
Format: eBook
Language: English
Published: West Conshohocken, PA : ASTM International, [2017]
Series: Selected technical papers ; STP1599
Subjects:
ISBN: 9780803176485
0803176481
9780803176478
Physical Description: 1 online resource.

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Item Description: "Contains peer-reviewed papers that were presented at a symposium held October 26-27, 2016, in Orlando, Florida, USA. The workshop was sponsored by ASTM International Committee C16 on Thermal Insulation and Subcommittee C16.33 on Insulation Finishes and Moisture."
Bibliography: Includes bibliographical references and index.
ISBN: 9780803176485
0803176481
9780803176478
Access: Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty