Practical guide to the packaging of electronics : thermal and mechanical design and analysis
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| Main Author | |
|---|---|
| Format | Electronic eBook |
| Language | English |
| Published |
Boca Raton :
Taylor & Francis, CRC Press,
2016.
|
| Edition | Third edition. |
| Subjects | |
| Online Access | Full text |
| ISBN | 9781315351087 1315351080 9781498754026 1498754023 9781315368092 1315368099 9781315332048 1315332043 9781498753951 1498753957 |
| Physical Description | 1 online resource |
Cover
Table of Contents:
- 1. Introduction
- 2. Basic heat transfer : conduction, convection, and radiation
- 3. Conductive cooling
- 4. Radiation cooling
- 5. Fundamentals of convection cooling
- 6. Combined modes, transient heat transfer, and advanced materials
- 7. Basics of vibration and its isolation
- 8. Basics of shock management
- 9. Induced stresses
- 10. The finite element methods
- 11. Mechanical and thermomechanical concerns
- 12. Acoustics
- 13. Mechanical failures and reliability
- 14. Electrical failures and reliability
- 15. Chemical attack failures and reliability concerns
- 16. Reliability models, predictions, and calculations
- 17. Design considerations in an avionics electronic package.