Practical guide to the packaging of electronics : thermal and mechanical design and analysis
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| Main Author: | |
|---|---|
| Format: | eBook |
| Language: | English |
| Published: |
Boca Raton :
Taylor & Francis, CRC Press,
2016.
|
| Edition: | Third edition. |
| Subjects: | |
| ISBN: | 9781315351087 1315351080 9781498754026 1498754023 9781315368092 1315368099 9781315332048 1315332043 9781498753951 1498753957 |
| Physical Description: | 1 online resource |
Cover
Table of contents
| LEADER | 02890cam a2200469 i 4500 | ||
|---|---|---|---|
| 001 | kn-ocn965377750 | ||
| 003 | OCoLC | ||
| 005 | 20240717213016.0 | ||
| 006 | m o d | ||
| 007 | cr cn||||||||| | ||
| 008 | 161206s2016 flu ob 001 0 eng d | ||
| 040 | |a N$T |b eng |e rda |e pn |c N$T |d YDX |d UIU |d CRCPR |d UAB |d STF |d OCLCQ |d IAQ |d OCLCQ |d OTZ |d CAUOI |d ERL |d OCLCQ |d NRC |d CEF |d UPM |d U3W |d OCLCQ |d NLE |d UKMGB |d WYU |d S9I |d TYFRS |d ESU |d OCLCQ |d UKAHL |d EUN |d OCLCO |d OCLCQ |d OCLCO |d K6U |d OCLCQ |d SFB |d OCLCQ |d OCLCO |d OCLCL | ||
| 020 | |a 9781315351087 |q (electronic bk.) | ||
| 020 | |a 1315351080 |q (electronic bk.) | ||
| 020 | |a 9781498754026 | ||
| 020 | |a 1498754023 | ||
| 020 | |a 9781315368092 | ||
| 020 | |a 1315368099 | ||
| 020 | |a 9781315332048 | ||
| 020 | |a 1315332043 | ||
| 020 | |z 9781498753951 | ||
| 020 | |z 1498753957 | ||
| 024 | 7 | |a 10.1201/9781315368092 |2 doi | |
| 035 | |a (OCoLC)965377750 |z (OCoLC)965493016 |z (OCoLC)965745496 | ||
| 100 | 1 | |a Jamnia, Ali, |d 1961- |e author. |1 https://id.oclc.org/worldcat/entity/E39PCjtTMtVHBB93cvjqMDymkC | |
| 245 | 1 | 0 | |a Practical guide to the packaging of electronics : |b thermal and mechanical design and analysis / |c Ali Jamnia. |
| 250 | |a Third edition. | ||
| 264 | 1 | |a Boca Raton : |b Taylor & Francis, CRC Press, |c 2016. | |
| 264 | 4 | |c ©2016 | |
| 300 | |a 1 online resource | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 504 | |a Includes bibliographical references and index. | ||
| 505 | 0 | |a 1. Introduction -- 2. Basic heat transfer : conduction, convection, and radiation -- 3. Conductive cooling -- 4. Radiation cooling -- 5. Fundamentals of convection cooling -- 6. Combined modes, transient heat transfer, and advanced materials -- 7. Basics of vibration and its isolation -- 8. Basics of shock management -- 9. Induced stresses -- 10. The finite element methods -- 11. Mechanical and thermomechanical concerns -- 12. Acoustics -- 13. Mechanical failures and reliability -- 14. Electrical failures and reliability -- 15. Chemical attack failures and reliability concerns -- 16. Reliability models, predictions, and calculations -- 17. Design considerations in an avionics electronic package. | |
| 506 | |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty | ||
| 590 | |a Knovel |b Knovel (All titles) | ||
| 650 | 0 | |a Electronic packaging. | |
| 655 | 7 | |a elektronické knihy |7 fd186907 |2 czenas | |
| 655 | 9 | |a electronic books |2 eczenas | |
| 776 | 0 | 8 | |i Print version: |a Jamnia, Ali, 1961- |t Practical guide to the packaging of electronics. |b Third edition. |d Boca Raton : Taylor & Francis, CRC Press, 2016 |z 9781498753951 |w (DLC) 2015049165 |w (OCoLC)933219059 |
| 856 | 4 | 0 | |u https://proxy.k.utb.cz/login?url=https://app.knovel.com/hotlink/toc/id:kpPGPETMD1/practical-guide-to?kpromoter=marc |y Full text |
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