Thermal management of microelectronic equipment

• Main Author: Yeh, L.-T. 1944- (Author)
• Format: Electronic eBook
• Language: English
• Published: New York : ASME, 2016.
• Edition: Second edition.
• Subjects: Electronic apparatus and appliances > Cooling.; Microelectronics.; Electronic apparatus and appliances > Thermal properties.; Heat > Transmission.; Semiconductors > Protection.; elektronické knihy; electronic books
• ISBN: 9780791861097; 0791861090
• Physical Description: 1 online resource (xxx, 492 pages)

Table of Contents:

• 1 Introduction
• 2 Conduction
• 3 Convection
• 4 Radiation
• 5 Pool Boiling
• 6 Flow Boiling
• 7 Condensation
• 8 Extended Surfaces
• 9 Thermal Interface Resistance
• 10 Component and Printed Circuit Board
• 11 Direct Air Cooling and Fans
• 12 Natural and Mixed Convection
• 13 Heat Exchangers and Cold Plates
• 14 Advanced Cooling Technologies I: Single-Phase Liquid Cooling
• 15 Advanced Cooling Technologies II: Two-Phase Flow Cooling
• 16 Heat Pipes and Others
• 17 Thermoelectric Devices
• 18 Microwave Modules and GaAs Chips.