rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Thermal management of microelectronic equipment
  name:
    name part: Yeh, L.-T. (Lian-Tuu)
    name part: 1944-
    role:
      role term: creator
    role:
      role term: author.
  type of resource: text
  genre: bibliography
  genre: elektronické knihy
  genre: electronic books
  origin info:
    place:
      place term: nyu
    date issued: 2016
    edition: Second edition.
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: remote
    extent: 1 online resource (xxx, 492 pages)
  abstract: This Second Edition of a classic text is fully updated and greatly expanded, with in-depth revisions that include advancements in the component technology of microelectronics. The most noticeable one is the addition of an entirely new chapter on microwave modules and the gallium arsenide (GaAs) chips, which have seldom been discussed in any of the textbooks or publications in the area of thermal management of electronic equipment. With this new chapter, the book is complete and whole in the area of thermal design of electronics systems. With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume.
  table of contents: 1 Introduction -- 2 Conduction -- 3 Convection -- 4 Radiation -- 5 Pool Boiling -- 6 Flow Boiling -- 7 Condensation -- 8 Extended Surfaces -- 9 Thermal Interface Resistance -- 10 Component and Printed Circuit Board -- 11 Direct Air Cooling and Fans -- 12 Natural and Mixed Convection -- 13 Heat Exchangers and Cold Plates -- 14 Advanced Cooling Technologies I: Single-Phase Liquid Cooling -- 15 Advanced Cooling Technologies II: Two-Phase Flow Cooling -- 16 Heat Pipes and Others -- 17 Thermoelectric Devices -- 18 Microwave Modules and GaAs Chips.
  note: Lian-Tuu Yeh.
  note: Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty
  note: Includes bibliographical references and index.
  subject:
    geographic code: n-us-ny
  subject:
    topic: Electronic apparatus and appliances
    topic: Cooling
  subject:
    topic: Microelectronics
  subject:
    topic: Electronic apparatus and appliances
    topic: Thermal properties
  subject:
    topic: Heat
    topic: Transmission
  subject:
    topic: Semiconductors
    topic: Protection
  identifier: 9780791861097
  identifier: 0791861090
  identifier: https://proxy.k.utb.cz/login
  access condition: Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty
  record info:
    record content source: ERL
    record creation date: 160414
    record change date: 20240717213016.0
    record identifier: kn-ocn958185404
    language of cataloging:
      language term: eng