Thermal management of microelectronic equipment

This Second Edition of a classic text is fully updated and greatly expanded, with in-depth revisions that include advancements in the component technology of microelectronics. The most noticeable one is the addition of an entirely new chapter on microwave modules and the gallium arsenide (GaAs) chip...

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Bibliographic Details
Main Author: Yeh, L.-T. 1944- (Author)
Format: eBook
Language: English
Published: New York : ASME, 2016.
Edition: Second edition.
Subjects:
Electronic apparatus and appliances > Cooling.
Microelectronics.
Electronic apparatus and appliances > Thermal properties.
Heat > Transmission.
Semiconductors > Protection.
elektronické knihy
electronic books
ISBN: 9780791861097
0791861090
Physical Description: 1 online resource (xxx, 492 pages)

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Table of contents

LEADER 03577cam a2200421Mi 4500
001 kn-ocn958185404
003 OCoLC
005 20240717213016.0
006 m o d
007 cr cn|||||||||
008 160414s2016 nyu ob 001 0 eng d
040 |a ERL  |b eng  |e rda  |c ERL  |d OCLCO  |d UIU  |d OCLCF  |d ESU  |d OTZ  |d MERER  |d OCLCQ  |d U3G  |d OCLCQ  |d OCLCO  |d OCLCQ  |d OCLCO  |d OCLCL  |d PUL 
020 |z 9780791861097  |q (hbk.) 
020 |z 0791861090  |q (hbk.) 
035 |a (OCoLC)958185404  |z (OCoLC)1036271794  |z (OCoLC)1086990794 
041 7 |a eng  |2 iso639-3 
043 |a n-us-ny 
100 1 |a Yeh, L.-T.  |q (Lian-Tuu),  |d 1944-  |e author.  |1 https://id.oclc.org/worldcat/entity/E39PCjJG9ccw49WhR6Q8H6YwYP 
245 1 0 |a Thermal management of microelectronic equipment /  |c Lian-Tuu Yeh. 
250 |a Second edition. 
264 1 |a New York :  |b ASME,  |c 2016. 
300 |a 1 online resource (xxx, 492 pages) 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
504 |a Includes bibliographical references and index. 
505 0 |a 1 Introduction -- 2 Conduction -- 3 Convection -- 4 Radiation -- 5 Pool Boiling -- 6 Flow Boiling -- 7 Condensation -- 8 Extended Surfaces -- 9 Thermal Interface Resistance -- 10 Component and Printed Circuit Board -- 11 Direct Air Cooling and Fans -- 12 Natural and Mixed Convection -- 13 Heat Exchangers and Cold Plates -- 14 Advanced Cooling Technologies I: Single-Phase Liquid Cooling -- 15 Advanced Cooling Technologies II: Two-Phase Flow Cooling -- 16 Heat Pipes and Others -- 17 Thermoelectric Devices -- 18 Microwave Modules and GaAs Chips. 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty 
520 3 |a This Second Edition of a classic text is fully updated and greatly expanded, with in-depth revisions that include advancements in the component technology of microelectronics. The most noticeable one is the addition of an entirely new chapter on microwave modules and the gallium arsenide (GaAs) chips, which have seldom been discussed in any of the textbooks or publications in the area of thermal management of electronic equipment. With this new chapter, the book is complete and whole in the area of thermal design of electronics systems. With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. 
590 |a Knovel  |b Knovel (All titles) 
650 0 |a Electronic apparatus and appliances  |x Cooling. 
650 0 |a Microelectronics. 
650 0 |a Electronic apparatus and appliances  |x Thermal properties. 
650 0 |a Heat  |x Transmission. 
650 0 |a Semiconductors  |x Protection. 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
856 4 0 |u https://proxy.k.utb.cz/login?url=https://app.knovel.com/hotlink/toc/id:kpTMMEHTT1/thermal-management-of?kpromoter=marc  |y Full text 

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