Microwave and millimeter-wave electronic packaging
Presenting the packaging issues which are unique to microwave and millimeter-wave frequencies, this book reviews lower frequency packaging techniques and how they can be tailored or analyzed for higher frequency designs. --
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| Main Author | |
|---|---|
| Format | Electronic eBook |
| Language | English |
| Published |
Boston [Massachusetts] ; London [England] :
Artech House,
2014.
|
| Series | Artech House microwave library.
|
| Subjects | |
| Online Access | Full text |
| ISBN | 9781608076987 1608076989 1608076970 9781608076970 9781523117420 1523117427 |
| Physical Description | 1 online resource (281 pages) : illustrations |
Cover
Table of Contents:
- Introduction
- Materials
- Ceramic packaging
- Laminate packaging
- First-level interconnects
- Second-level interconnects
- Modules and motherboards
- Transitions and 3D packaging
- Heat transfer
- Electromagnetic modeling
- Conclusions and future horizons.