Microwave and millimeter-wave electronic packaging

Presenting the packaging issues which are unique to microwave and millimeter-wave frequencies, this book reviews lower frequency packaging techniques and how they can be tailored or analyzed for higher frequency designs. --

Saved in:
Bibliographic Details
Main Author: Sturdivant, Rick, (Author)
Format: eBook
Language: English
Published: Boston [Massachusetts] ; London [England] : Artech House, 2014.
Series: Artech House microwave library.
Subjects:
Microelectronic packaging.
elektronické knihy
electronic books
ISBN: 9781608076987
1608076989
1608076970
9781608076970
9781523117420
1523117427
Physical Description: 1 online resource (281 pages) : illustrations

Cover

Table of contents

LEADER 02836cam a2200445 i 4500
001 kn-ocn922474990
003 OCoLC
005 20240717213016.0
006 m o d
007 cr cn|||||||||
008 150710t20142014maua ob 001 0 eng d
040 |a CaPaEBR  |b eng  |e rda  |e pn  |c STF  |d OCLCO  |d YDXCP  |d OCLCF  |d N$T  |d COO  |d AGLDB  |d MOR  |d PIFAG  |d UAB  |d OCLCQ  |d DEBSZ  |d K6U  |d U3W  |d COCUF  |d D6H  |d STF  |d OCLCQ  |d VTS  |d VLB  |d MERER  |d INT  |d CUY  |d VT2  |d AU@  |d CEF  |d ERL  |d OCLCQ  |d WYU  |d OCLCQ  |d LVT  |d TKN  |d OCLCQ  |d UWW  |d KNOVL  |d M8D  |d UKAHL  |d ZCU  |d OCLCQ  |d OCLCO  |d OCLCQ  |d OCLCO  |d OCLCL  |d SXB 
020 |a 9781608076987  |q (electronic bk.) 
020 |a 1608076989  |q (electronic bk.) 
020 |a 1608076970 
020 |a 9781608076970 
020 |a 9781523117420  |q (electronic) 
020 |a 1523117427 
020 |z 9781608076970 
035 |a (OCoLC)922474990  |z (OCoLC)961509824  |z (OCoLC)962631428  |z (OCoLC)1055349029  |z (OCoLC)1066615801  |z (OCoLC)1081275557  |z (OCoLC)1087048107  |z (OCoLC)1099600717  |z (OCoLC)1228585151 
100 1 |a Sturdivant, Rick,  |e author. 
245 1 0 |a Microwave and millimeter-wave electronic packaging /  |c Rick Sturdivant. 
264 1 |a Boston [Massachusetts] ;  |a London [England] :  |b Artech House,  |c 2014. 
264 4 |c ©2014 
300 |a 1 online resource (281 pages) :  |b illustrations 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
490 1 |a Artech House Microwave Library 
504 |a Includes bibliographical references at the end of each chapters and index. 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty 
520 |a Presenting the packaging issues which are unique to microwave and millimeter-wave frequencies, this book reviews lower frequency packaging techniques and how they can be tailored or analyzed for higher frequency designs. --  |c Edited summary from book. 
505 0 |a Introduction -- Materials -- Ceramic packaging -- Laminate packaging -- First-level interconnects -- Second-level interconnects -- Modules and motherboards -- Transitions and 3D packaging -- Heat transfer -- Electromagnetic modeling -- Conclusions and future horizons. 
590 |a Knovel  |b Knovel (All titles) 
650 0 |a Microelectronic packaging. 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
776 0 8 |i Print version:  |a Sturdivant, Rick.  |t Microwave and millimeter-wave electronic packaging.  |d Boston, [Massachusetts] ; London, [England] : Artech House, ©2014  |h xvii, 261 pages  |k Artech House microwave library.  |z 9781608076970 
830 0 |a Artech House microwave library. 
856 4 0 |u https://proxy.k.utb.cz/login?url=https://app.knovel.com/hotlink/toc/id:kpMMWEP002/microwave-and-millimeter?kpromoter=marc  |y Full text 

Similar Items