Robust design of microelectronics assemblies against mechanical shock, temperature and moisture

This book discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. De...

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Bibliographic Details
Main Authors: Wong, E. -H. (Author), Mai, Y. W., 1946- (Author)
Format: eBook
Language: English
Published: Cambridge, UK : Woodhead Publishing, [2015]
Series: Woodhead Publishing series in electronic and optical materials ; no. 81.
Subjects:
Computer engineering.
Microelectronics > Design.
elektronické knihy
electronic books
ISBN: 9780857099112
0857099116
1845695283
9781845695286
Physical Description: 1 online resource

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Table of contents

LEADER 05787cam a2200481 i 4500
001 kn-ocn910159095
003 OCoLC
005 20240717213016.0
006 m o d
007 cr cn|||||||||
008 150527s2015 enk ob 001 0 eng d
040 |a N$T  |b eng  |e rda  |e pn  |c N$T  |d IDEBK  |d EBLCP  |d N$T  |d YDXCP  |d CUS  |d OPELS  |d KNOVL  |d OCLCF  |d B24X7  |d ZCU  |d S9I  |d DEBSZ  |d COO  |d OCLCQ  |d K6U  |d U3W  |d D6H  |d CEF  |d RRP  |d UKMGB  |d YOU  |d CUY  |d MERUC  |d ICG  |d DKC  |d OCLCQ  |d BRF  |d OCLCO  |d SGP  |d UCW  |d OCLCQ  |d UPM  |d OCLCQ  |d OCLCO  |d OCLCL  |d SXB  |d OCLCQ  |d OCLCO 
020 |a 9780857099112  |q (electronic bk.) 
020 |a 0857099116  |q (electronic bk.) 
020 |a 1845695283 
020 |a 9781845695286 
020 |z 9781845695286 
035 |a (OCoLC)910159095  |z (OCoLC)951674771 
100 1 |a Wong, E. -H.  |q (Ee-Hua),  |e author.  |1 https://id.oclc.org/worldcat/entity/E39PCjyTMJtW7KWTRyJ4yFdhHC 
245 1 0 |a Robust design of microelectronics assemblies against mechanical shock, temperature and moisture /  |c E.-H. Wong and Y.-W. Mai. 
264 1 |a Cambridge, UK :  |b Woodhead Publishing,  |c [2015] 
300 |a 1 online resource 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
490 1 |a Woodhead Publishing series in electronic and optical materials ;  |v number 81 
504 |a Includes bibliographical references and index. 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty 
520 |a This book discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. Detailed chapters cover: temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. --  |c Edited summary from book. 
505 0 |a Front Cover; Related titles; Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and MoistureWoodhead Publishing Series i ... ; Copyright; Contents; Woodhead Publishing Series in Electronic and Optical Materials; Foreword; Preface; 1 -- Introduction; 1.1 Introduction to microelectronic packaging; 1.2 Introduction to robust design; 1.3 Organisation of the book; References; Part 1 -- Advances in robust design against temperature-induced failures; 2 -- Robust design of microelectronic assemblies against mismatched thermal expansion; 2.1 Introduction; 2.2 Fundamentals 
505 8 |a 2.3 Comprehensive analysis of a bilayer structure2.4 Microelectronic assembly as a sandwich structure with a continuous bonding layer; 2.5 PCB assembly as a sandwich structure with a layer of solder joints; References; 2. Appendix: prior published works in thermoelasticity; 2. Nomenclature; 2. Mathematical symbols; 3 -- Advances in creep-fatigue modelling of solder joints; 3.1 Introduction; 3.2 Life-prediction models for creep-fatigue; 3.3 The unified equation; 3.4 Self-validations and benchmarking; 3.5 Applications; References 
505 8 |a Part 2 -- Advances in robust design against moisture-induced failures4 -- Moisture properties and their characterisations; 4.1 Introduction; 4.2 Thermodynamics of water; 4.3 Sorption and its characterisation; 4.4 Diffusivity and its characterisation; 4.5 Hygroscopic swelling and its characterisation; References; 5 -- Advances in diffusion and vapour pressure modelling; 5.1 The discontinuity of concentration; 5.2 The fractional saturation; 5.3 Diffusion under time-varying temperature and pressure; 5.4 Advances in vapour pressure modelling; References; Part 3 -- Robust design against drop impact 
505 8 |a 6 -- The physics of failure of portable electronic devices in drop impact6.1 Product drop testing; 6.2 The physics of failure; References; 7 -- Subsystem testing of solder joints against drop impact; 7.1 Board-level testing; 7.2 Component-level testing; References; 8 -- Fatigue resistance of solder joints: strain-life representation; 8.1 Introduction; 8.2 Design of test specimens; 8.3 Fatigue resistance equations: materials; 8.4 Fatigue resistance equations: frequency; 8.5 Fatigue resistance equations: environment; References; 9 -- Fatigue crack growth in solder joints at high strain rate 
505 8 |a 9.1 Introduction9.2 Establishment of continuous crack growth tracking capability; 9.3 Crack propagation characteristics: board-level drop shock test; 9.4 Crack propagation characteristics: high-speed cyclic bending test; 9.5 Three-dimensional fracture mechanics modelling of the crack front; 9.6 Crack propagation in the solder joints of a mobile phone experiencing drop impact; References; 10 -- Dynamic deformation of a printed circuit board in drop-shock; 10.1 Introduction; 10.2 Vibration of a test board in the JESD22-B111 drop-shock test 
590 |a Knovel  |b Knovel (All titles) 
650 0 |a Computer engineering. 
650 0 |a Microelectronics  |x Design. 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
700 1 |a Mai, Y. W.,  |d 1946-  |e author.  |1 https://id.oclc.org/worldcat/entity/E39PBJjxtmBWYRtwtgHxrdHpyd 
776 0 8 |i Print version:  |a Wong, E- H.  |t Robust design of microelectronics assemblies against mechanical schock, temperature and moisture.  |d Boston, MA : Elsevier, [2015]  |k Woodhead Publishing series in electronic and optical materials ; number 81  |x 2050-1501  |z 9781845695286  |w (DLC) 18461254 
830 0 |a Woodhead Publishing series in electronic and optical materials ;  |v no. 81. 
856 4 0 |u https://proxy.k.utb.cz/login?url=https://app.knovel.com/hotlink/toc/id:kpRDMAAMS1/robust-design-of?kpromoter=marc  |y Full text 

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